• The 3700Plus: wire bonders designed for hybrid and automotive modules using
thin aluminum wire.
• The 7200Plus: dual head wedge bonder designed specifically for power
• The 7200HD: heavy wire wedge bonder designed for smaller power packages
using either aluminum wire or ribbon.
• The 7600HD: heavy wire wedge bonder targeted for small power packages.
While wedge bonding traditionally utilizes aluminum wire, all of our heavy wire wedge bonders are also available to be modified to bond aluminum ribbon using our proprietary PowerRibbon® process. Aluminum ribbon offers device makers performance advantages over traditional round wire and is being increasingly used for high current packages and automotive applications. In
March 2013, we introduced PowerFusionPS, which is driven by new powerful direct-drive motion systems and expanded pattern recognition capabilities. The advanced interconnect capabilities of PowerFusionPS improves the processing of high-density power packages, due to an expanded bondable area, wider leadframe capability and superior indexing accuracy and teach mode. Other Equipment Products and Services We also sell manual wire bonders, and we offer spare parts, equipment repair, training services, and upgrades for our equipment through our Support Services business unit. In September 2012, we introduced a next-generation manual wire bonder series for use with gold, copper or aluminum wire. In March 2013, we introduced K&S Care, a new professional service, designed to help customers operate their machines at an optimum level under the care our trained specialists. K&S Care has a range of programs, offering different levels of service depending on customer needs. 24
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Expendable Tools Segment We manufacture and sell a variety of expendable tools for a broad range of semiconductor packaging applications. Our principal Expendable Tools segment products include: • Capillaries: expendable tools used in ball bonders. Made of ceramic and
other elements, a capillary guides the wire during the ball bonding
process. Its features help control the bonding process. We design and build
capillaries suitable for a broad range of applications, including for use
on our competitors' equipment. In addition to capillaries used for gold
wire bonding, we have developed capillaries for use with copper wire to
achieve optimal performance in copper wire bonding.
• Bonding wedges: expendable tools used in heavy wire wedge bonders. Like
capillaries, their specific features are tailored to specific applications.
We design and build bonding wedges for use both in our own equipment and in
our competitors' equipment. • Saw blades: expendable tools used by semiconductor manufacturers to cut
silicon wafers into individual semiconductor die and to cut semiconductor
devices that have been moulded in a matrix configuration into individual
March 2013, we introduced the Optoceramic and OptoPCB package singulation blades for the LED market. The blades enable an improvement on package singulation quality, precision and productivity by providing a significantly longer life blade, and improved stability.