"Meanwhile, it is possible to form the sealing ring in a closed loop shape with SnAg solder having a low melting point. As this sealing ring is typically formed on top of a polymer layer on the photosensor, some moisture can still penetrate under the sealing ring and enter the pixel area. Thus during subsequent processing, such as SMT (
Supplementing the background information on this patent, VerticalNews reporters also obtained the inventors' summary information for this patent: "The present disclosure provides an electronic device package including a sealing ring capable of preventing foreign substances from entering a protected region of an electronic device such as a pixel region of a photosensor chip, wherein a defect such as the sealing ring blowout is not caused although the sealing ring is formed in a closed loop shape, and a method for fabricating the electronic device package.
"The present disclosure provides an electronic device package where a sealing ring includes a stacked layer of a sealing layer and a bonding layer formed in a closed loop shape to prevent the inflow of a foreign substance and the occurrence of a defect such as the blowout of the sealing ring, and a method for fabricating the electronic device package.
"The present disclosure provides an electronic device package where a sealing layer and a low-melting-point material layer are stacked, and then a bonding layer is formed by the reaction between the low-melting-point material layer, and a sealing ring pad and the sealing layer when the low-melting-point material layer melts, and a method for fabricating the electronic device package.
"In accordance with an exemplary embodiment, an electronic device package includes: a substrate assembly; an electronic device disposed to face the substrate assembly; and at least one sealing ring including a sealing layer, a bonding layer and a sealing ring pad disposed between the substrate assembly and the electronic device, and one or more joints which are disposed inside the sealing ring, outside of the sealing ring or both inside and outside the sealing and connect the substrate assembly and the electronic device.
"An internal empty space may be formed by the sealing ring, and the bonding layer may be an intermetallic compound.
"The electronic device may include a photosensor, a micro electro mechanical systems (MEMS) device, a silicon base device, a GaAs base device, or an InP base device.
"The substrate assembly may include an optically transparent substrate.
"The sealing layer may be formed on one of the substrate assembly and the electronic device, and the low-melting-point material layer may be formed on the sealing layer.
"The electronic device package may further include a sealing ring pad formed on the other one of the substrate assembly and the electronic device, wherein the sealing ring pad is formed in a region corresponding to a region where the sealing layer is formed.
"The low-melting-point material layer may use a material whose melting point is lower than those of the sealing layer and the sealing ring pad.
"The sealing layer may include one selected from the group consisting of Cu, Au, Sn, SnAg, SnAgCu, Ag, Ni and a combination thereof.
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