"According to one preferred refinement, it is provided that the first deformation is measured with the aid of first piezoresistive elements, and the second deformation is measured with the aid of second piezoresistive elements, so that the first deformation preferably generates a first voltage signal, and the second deformation preferably generates a second voltage signal. Thus, the absolute first pressure may be determined in a particularly simple manner with comparatively little complexity of circuitry and wiring by determining the difference between the first voltage signal and the second voltage signal.
"A further subject matter of the present invention is a method for manufacturing a sensor system, the substrate being provided in a first manufacturing step, the cavern being produced in a second manufacturing step, and the trench being produced in a third manufacturing step, thus allowing comparatively inexpensive manufacture of the sensor system in a particularly advantageous manner, using standard manufacturing processes of the semiconductor industry.
"According to one preferred refinement, it is provided that in a fourth manufacturing step which in particular is carried out between the second and the third manufacturing steps, the measuring elements and/or the evaluation circuit are situated in the region of the second side, resulting in direct integration of the electrical and electronic components into the manufacturing process of the sensor system, so that additional contacting and/or implementing steps may be dispensed with.
"According to another preferred refinement, it is provided that the second manufacturing step includes a first and a second substep, a porous layer being formed in the substrate in the first substep, and an etching process being used to produce a cavern beneath and/or in the porous layer in the second substep, the second manufacturing step preferably being carried out from the second side. Comparatively inexpensive manufacture of the cavern is thus possible in a particularly advantageous manner, in particular using the known advanced porous silicon membrane (APSM) technology known, for example, from published international patent application document WO 02/02458, published German patent application document DE 10 2004 036 032 A1, and published German patent application document DE 10 2004 036 035 A1.
"According to another preferred refinement, it is provided that in the third manufacturing step the trench is produced in an etching process, in particular a trench process, from the second side, so that trenches having a comparatively high aspect ratio may be produced in a particularly advantageous manner."
For additional information on this patent, see: Ahles, Marcus; Benzel, Hubert; Weber, Heribert. Sensor System, Method for Operating a Sensor System, and Method for Manufacturing a Sensor System. U.S. Patent Number 8485041, filed
Keywords for this news article include: Electronics, Semiconductor,
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