Patent Application Titled "Photocurable Adhesive Film for Organic Electronic Device Seal, Organic Electronic Device and Method for Sealing Same" Published Online
The assignee for this patent application is
Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to an organic electronic device, and particularly, to a photocurable pressure-sensitive adhesive composition used to encapsulate an organic electronic device, an adhesive film formed thereof, and a method for manufacturing an organic electronic device.
"An organic electronic device (OED) refers to a device including an organic material layer generating the exchange of charges using holes and electrons, and for example, the OED includes a photovoltaic device, a rectifier, a transmitter and an organic light-emitting diode (OLED).
"A representative OED, which is an OLED, has less power consumption and a higher response speed, and forms a thinner display device or light than a conventional light source. In addition, the OLED has excellent space utilization, and is expected to be applied in various fields including all kinds of portable devices, monitors, notebook computers and TVs.
"To extend compatibility and use of the OLED, a major problem is durability. Organic materials and metal electrodes included in the OLED are very easily oxidized by external factors such as moisture, and a product including the OLED is very sensitive to environmental factors. Therefore, various methods to prevent penetration of oxygen or moisture from an external environment have been suggested.
"A large-scale element has a limitation to an edge sealing method due to the deterioration of the element caused by the lack of mechanical strength and the decrease in efficiency of heat emission. Generally, an UV edge sealing or frit method in combination with a getter additionally uses a heat-curable/visible ray-curable filled adhesive, which thus makes a process complicated, resulting in an increase in cost.
"In addition, while the edge sealing may improve mechanical strength and ensure a moisture barrier characteristic according to the type of filling, the edge sealing may be difficult to apply to a flexible display. The heat-curable entire surface filler is necessarily cured at low temperature to avoid damage to an element. However, since the heat-curable filler has a pot life to be cured at low temperature, processibility is degraded. The visible ray-curable filler has difficult curing conditions and a limitation to selection of a material, compared with a UV-curable filler.
"In Korean Patent Publication No. 2008-0074372, a photopolymerization adhesive composition, which is present in a liquid-state at room temperature, including an epoxy resin, an acrylate resin, a cationic photopolymerization initiator and a radical photopolymerization initiator, is disclosed. When the above composition is coated on an entire surface of an organic light-emitting element, and the organic light-emitting element is assembled and encapsulated, the organic light-emitting element may be damaged due to the radiation of light. Moreover, the above method is a liquid-state method, which has many limitations."
In addition to obtaining background information on this patent application, VerticalNews editors also obtained the inventors' summary information for this patent application: "The present invention is directed to providing an OED which may effectively encapsulate an organic light-emitting element without direct radiation of light to the organic light-emitting element, and enhance the lifespan of the element, a method of manufacturing the same, a curable pressure-sensitive adhesive composition for encapsulating the same, and a curable pressure-sensitive adhesive film.
"In one aspect, the present invention provides an OED including a substrate on which an organic light-emitting element is formed, and a curable pressure-sensitive adhesive film encapsulating an entire surface of the organic light-emitting element on the substrate.
"Here, the curable pressure-sensitive adhesive film includes a curable pressure-sensitive adhesive layer including a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, a crosslinking agent and a photoinitiator, and only an edge of the curable pressure-sensitive adhesive layer that is not directly contact with the organic light-emitting element is photocured.
"In another aspect, the present invention provides a method for manufacturing an organic electronic device, including assembling a photocurable pressure-sensitive adhesive film including a curable pressure-sensitive adhesive layer including an acrylic polymer, an epoxy resin, a crosslinking agent and a photoinitiator with an top substrate, assembling the top substrate with a bottom substrate on which an organic light-emitting element is formed to cover an entire surface of the organic light-emitting element with the curable pressure-sensitive adhesive layer, and radiating light only to an edge of the assembled top and bottom substrates at which the organic light-emitting element is not disposed to photocure.
"In still another aspect, the present invention provides a photocurable pressure-sensitive adhesive composition for encapsulating an OED including an acrylic polymer, an epoxy resin, a crosslinking agent and a photoinitiator.
"In yet another aspect, a photocurable pressure-sensitive adhesive film for encapsulating an OED, which is a film-state product including the photocurable pressure-sensitive adhesive composition, including a curable pressure-sensitive adhesive layer having a viscosity at 25.degree. C. of 10.sup.5 to 10.sup.7 Pas.
"According to exemplary embodiments of the present invention, there is no damage to an element by light since light is not directly radiated to the element, and mechanical strength can be ensured and a simple process and minimum tact time can also be ensured by photocuring due to entire encapsulation of an OED panel. In addition, since an organic light-emitting element is encapsulated with a semi-solid phase curable pressure-sensitive adhesive film at room temperature, it can be applied to a flexible display.
BRIEF DESCRIPTION OF THE DRAWINGS
"FIG. 1 is a plan view of an OED according to an exemplary embodiment of the present invention.
"FIG. 2 is a schematic diagram showing a method for manufacturing an OED according to an exemplary embodiment of the present invention."
For more information, see this patent application: CHO,
Keywords for this news article include: Emerging Technologies,
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