News Column

Patent Application Titled "Flex Circuit" Published Online

September 9, 2014



By a News Reporter-Staff News Editor at Information Technology Newsweekly -- According to news reporting originating from Washington, D.C., by VerticalNews journalists, a patent application by the inventors Farkas, Sandor (Round Rock, TX); Singh, Girish Kumar (Round Rock, TX); Mutnury, Bhyrav M. (Round Rock, TX), filed on February 18, 2013, was made available online on August 28, 2014.

No assignee for this patent application has been made.

Reporters obtained the following quote from the background information supplied by the inventors: "As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.

"As space constraints increase, flex circuits may be used instead of heavier, bulkier wire harnesses to provide electrical connections between hardware components in an information handling system. Flex circuits may include one or more layers of, conductive metal foil laminated between flexible layers of an insulating material. Thin layers may be used to promote flexibility and, for most materials, the stiffness of a given layer will increase with thickness.

"In addition to being lighter and smaller than wire harnesses or cables, flex circuits may also provide superior electrical and mechanical performance. A further advantage of flex circuits is that a wide range of interfaces may be used to connect a flex circuit to a component of an information handling system. For example, leads may be left bare so that they may slide into board mounted connectors. Additionally, connectors may be soldered or otherwise mechanically affixed directly to the traces within the flex circuit."

In addition to obtaining background information on this patent application, VerticalNews editors also obtained the inventors' summary information for this patent application: "In accordance with one embodiment of the present disclosure, a flex circuit including a plurality of layers folded on a first fold line and folded on a second fold line is disclosed. The plurality of layers may include a first conductive layer, an insulating layer adjacent the first conductive layer, and a second conductive layer adjacent the insulating layer. The flex circuit may include a plurality of slits extending through each layer of the plurality of layers, the plurality of slits disposed on the first fold line and the second fold line.

"In accordance with another embodiment of the present disclosure and information handling system is disclosed. The information handling system may include a first information handling component, a second information handling component, and a flex circuit configured to communicatively couple the first information handling component to the second information handling component. The flex circuit may include a plurality of layers folded on a first fold line and folded on a second fold line, and a plurality of slits extending through each layer of the flex circuit, the plurality of slits disposed on the first fold line and the second fold line.

"In accordance with yet another embodiment of the present disclosure, a method of manufacturing a flex circuit is disclosed. The method may include forming a plurality of layers including a first conductive layer, an insulating layer adjacent the first conductive layer, and a second conductive layer adjacent the insulating layer. The method may also include forming a plurality of slits extending through each layer of the plurality of layers, the plurality of slits disposed on a first fold line and a second fold line. The method may further include folding the plurality of layers on the first fold line and folding the plurality of layers on the second fold line.

BRIEF DESCRIPTION OF THE DRAWINGS

"A more complete understanding of the disclosed embodiments and advantages thereof may be acquired by referring to the following description taken in conjunction with the accompanying drawings, in which like reference numbers indicate like features, and wherein:

"FIG. 1 illustrates an example information handling system in accordance with one embodiment of the present disclosure;

"FIG. 2 illustrates a cross-sectional end view of a flex circuit configured to be rolled in accordance with one embodiment of the present disclosure;

"FIG. 3 illustrates cross-sectional end view of a rolled flex circuit in accordance with one embodiment of the present disclosure;

"FIG. 4A illustrates a cross-sectional end view of a flex circuit configured to be folded in accordance with another embodiment of the present disclosure;

"FIG. 4B illustrates a top view of a flex circuit configured to be folded in accordance with one embodiment of the present disclosure;

"FIG. 4C illustrates a cross-sectional end view of a folded flex circuit in accordance with one embodiment of the present disclosure;

"FIG. 5 illustrates a graph of the separation between exterior surfaces of a flex circuit when rolled or folded versus impedance of the flex circuit, in accordance with the teachings of the present disclosure;

"FIG. 6 illustrates a graph of the spacing between adjacent signal traces versus the electrical interference among adjacent signal traces, in accordance with the teachings of the present disclosure; and

"FIG. 7 illustrates an example method of manufacturing a flex circuit in accordance with the teachings of the present disclosure."

For more information, see this patent application: Farkas, Sandor; Singh, Girish Kumar; Mutnury, Bhyrav M. Flex Circuit. Filed February 18, 2013 and posted August 28, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4530&p=91&f=G&l=50&d=PG01&S1=20140821.PD.&OS=PD/20140821&RS=PD/20140821

Keywords for this news article include: Information Technology, Information and Data Storage, Patents.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Information Technology Newsweekly


Story Tools






HispanicBusiness.com Facebook Linkedin Twitter RSS Feed Email Alerts & Newsletters