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Micron Technology Assigned Patent for Forming Semiconductor Device Structure

September 5, 2014

By Targeted News Service

ALEXANDRIA, Va., Sept. 5 -- Micron Technology, Boise, Idaho, has been assigned a patent (8,815,752) developed by seven co-inventors for methods "of forming features in semiconductor device structures." The co-inventors are Adam L. Olson, Boise, Idaho, Kaveri Jain, Boise, Idaho, William R. Brown, Boise, Idaho, Lijing Gou, Boise, Idaho, Ho Seop Eom, Boise, Idaho, Xue Chen, Boise, Idaho, and Anton J. deVilliers, Clifton Park, New York.

The patent application was filed on Nov. 28, 2012 (13/687,419). The full-text of the patent can be found at

Written by Vessie Ann Abalos.


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Source: Targeted News Service

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