Researchers from Hanyang University Detail Findings in Electronics and Communications (Thermal-Aware Floorplanning with Min-cut Die Partition for 3D ICs)
By a News Reporter-Staff News Editor at Electronics Newsweekly -- Current study results on Electronics and Communications have been published. According to news reporting originating from Seoul, South Korea, by VerticalNews correspondents, research stated, "Three-dimensional integrated circuits (3D ICs) implement heterogeneous systems in the same platform by stacking several planar chips vertically with through-silicon via (TSV) technology. 3D ICs have some advantages, including shorter interconnect lengths, higher integration density, and improved performance. Thermal-aware design would enhance the reliability and performance of the interconnects and devices."
Our news editors obtained a quote from the research from Hanyang University, "In this paper, we propose thermal-aware floorplanning with min-cut die partitioning for 3D ICs. The proposed min-cut die partition methodology minimizes the number of connections between partitions based on the min-cut theorem and minimizes the number of TSVs by considering a complementary set from the set of connections between two partitions when assigning the partitions to dies. Also, thermal-aware floorplanning methodology ensures a more even power distribution in the dies and reduces the peak temperature of the chip."
According to the news editors, the research concluded: "The simulation results show that the proposed methodologies reduced the number of TSVs and the peak temperature effectively while also reducing the run-time."
For more information on this research see: Thermal-Aware Floorplanning with Min-cut Die Partition for 3D ICs. ETRI Journal, 2014;36(4):634-641. ETRI Journal can be contacted at: Electronics Telecommunications Research Inst, 161 Kajong-Dong, Yusong-Gu, Taejon 305-350, South Korea.
The news editors report that additional information may be obtained by contacting C. Jang, Hanyang University, Dept. of Elect Comp Engn, Seoul 133791, South Korea.
Keywords for this news article include: Seoul, South Korea, Asia, Electronics and Communications
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