News Column

Patent Issued for Semiconductor Module Having Sliding Case and Manufacturing Method

September 10, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- Samsung Electro-Mechanics Co., Ltd. (Suwon, Gyunggi-Do, KR) has been issued patent number 8816515, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventors are Lee, Young Ki (Suwon, KR); Kim, Kwang Soo (Suwon, KR); Kwak, Young Hoon (Suwon, KR); Yun, Sun Woo (Suwon, KR).

This patent was filed on February 27, 2013 and was published online on August 26, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "The present invention relates to a semiconductor module and a manufacturing method thereof, and more particularly, to a power semiconductor module able to be easily manufactured.

"Recently, market demand for small, light-weight portable electronic apparatuses has rapidly increased, and thus electronic components mounted therein have also been required to be small-sized and lightweight to satisfy market demand.

"Accordingly, in addition to a method of reducing a size of an electronic element itself, a method of installing as many elements and conducting wires as possible in a small defined space is an important consideration in semiconductor module design.

"In addition, a large amount of heat is generated when a power semiconductor element is driven. Such heat has an influence on a lifespan and operation of an electronic product, and thus, heat dissipation of a module is also an important issue.

"To this end, a power semiconductor module uses a structure in which both a power element and a control element are mounted on one surface of a circuit substrate and a heat sink used to dissipate heat is disposed on the other surface of the circuit substrate.

"Such a power semiconductor module mainly uses a method of molding the exterior of the power semiconductor module with a molding member so as to externally protect the circuit substrate or elements.

"However, a semiconductor module including the molding member requires a process of inserting the circuit substrate into a mold, injecting a molding material into the mold, and curing the molded material, making a manufacturing process disadvantageously complicated.

"Accordingly, a semiconductor module that may be easily manufactured and a manufacturing method thereof are required."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventors' summary information for this patent: "An aspect of the present invention provides a semiconductor module that is easily manufactured and a manufacturing method thereof.

"Another aspect of the present invention provides a semiconductor module having a case and a manufacturing method thereof.

"According to an aspect of the present invention, there is provided a semiconductor module including: a module substrate on which at least one electronic element is mounted; at least one external connection terminal fastened to the module substrate; and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.

"The case may include at least one moving slit in which the external connection terminal is disposed when the first case and the second case are coupled to each other.

"The moving slit may be formed to have a width corresponding to that of the external connection terminal.

"The moving slit may include at least one fixing projection inwardly protruded in such a manner that a width of the moving slit is reduced, in a side thereof in which the external connection terminal is finally disposed.

"One of the first case and the second case may include at least one insertion projection protruded outwardly, and the other thereof may include at least one accommodating groove into which the insertion projection is inserted.

"The first case and the second case may be formed such that edges of the first case and the second case in contact with each other are engaged with each other.

"The first case and the second case may include substrate accommodation parts to which the module substrate is slidably coupled.

"The semiconductor module may further include: a molding unit filling an interior of the case.

"The first case and the second case may be formed to have the same shape.

"According to another aspect of the present invention, there is provided a semiconductor module including: a module substrate on which at least one electronic element is mounted; at least one external connection terminal fastened to the module substrate; and a case formed by accommodating the module substrate in a first case and a second case and coupling the module substrate and the first case and the second case, wherein the module substrate is inserted into the first case and the second case in a sliding manner and coupled to the first case and the second case.

"According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor module, the method including: mounting at least one electronic element and at least one external connection element on a module substrate; disposing a first case and a second case at both ends of the module substrate; and coupling the first case and the second case to the module substrate by moving the first case and the second case so as to contact each other.

"The coupling of the first case and the second case to the module substrate may include: coupling the first case and the second case to the module substrate by inserting the module substrate into the first case and the second case in a sliding manner.

"The coupling of the first case and the second case to the module substrate may include: disposing the module substrate in substrate accommodation parts formed in the first case and the second case and disposing the external connection terminal in the moving slit formed in the first case and the second case.

"The method may further include: forming a molding unit by filling an interior of the case with a molding material."

For the URL and additional information on this patent, see: Lee, Young Ki; Kim, Kwang Soo; Kwak, Young Hoon; Yun, Sun Woo. Semiconductor Module Having Sliding Case and Manufacturing Method. U.S. Patent Number 8816515, filed February 27, 2013, and published online on August 26, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8816515.PN.&OS=PN/8816515RS=PN/8816515

Keywords for this news article include: Electronics, Samsung Electro-Mechanics Co., Samsung Electro-Mechanics Co. Ltd., Semiconductor.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Electronics Newsweekly


Story Tools






HispanicBusiness.com Facebook Linkedin Twitter RSS Feed Email Alerts & Newsletters