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Patent Issued for Semiconductor Chip Package Structure

September 10, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Liu, Chi-Chao (Yunlin County, TW); Wang, Chih-Jui (Taichung, TW); Chen, Long-Chi (Taoyuan County, TW), filed on April 23, 2014, was published online on August 26, 2014.

The patent's assignee for patent number 8816483 is Chunghwa Picture Tubes, Ltd. (Taoyuan, TW).

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a method for fixing a semiconductor chip on a circuit board and the structure thereof. More particularly, the present invention relates to method for fixing a semiconductor chip on a circuit board and the structure thereof for liquid crystal display devices.

"In recent years, the development of electronic products is moving toward high packaging density and high electrical reliability. As such, techniques like chip on film (COF) and chip on glass (COG) have been developed, in which the COG technique has been applied in liquid crystal display devices.

"A COG process is described as follows. Firstly, an anisotropic conductive film (ACF) is covered on contact pads and an insulating layer surrounding those pads. A semiconductor chip is then hot-pressed on the ACF to make bumps of the semiconductor chip respectively electrically connected the contact pads through the ACF. However, at the reliability test of a panel under high temperature and high humidity, the metal wires beneath the insulating layer are randomly corroded and broken, such that the panel may be scrapped.

"Accordingly, there is still a need for a method for fixing a semiconductor chip on a circuit board and the structure thereof, in order to solve the problems described above."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "An objective of the present invention is to provide a method for fixing a semiconductor chip on a circuit board to prevent metal wires from corrosion during a reliability test under high temperature and high humidity.

"According to one embodiment of the present invention, the method includes following steps. The circuit board is provided, in which the circuit board includes a substrate, at least a metal wire and an insulating layer. The substrate has a chip connecting portion. The metal wire is disposed on the substrate and extending from outside to inside of the chip connecting portion, and the metal wire has a contact pad disposed in the chip connecting portion. The insulating layer is disposed on the metal wire, and the insulating layer has an opening to expose the contact pad. An organic insulating material is formed on the insulating layer of an outside edge of the chip connecting portion. An ACF is formed to cover the chip connecting portion and a portion of the organic insulating material. The semiconductor chip is hot-pressed on the ACF to make a bump of the semiconductor chip electrically connected to the contact pad through the ACF.

"In another embodiment, the method includes following steps. The circuit board is provided, in which the circuit board includes a substrate, at least a metal wire and an insulating layer. The substrate has a chip connecting portion. The metal wire is disposed on the substrate and extending from outside to inside of the chip connecting portion, and the metal wire has a contact pad disposed in the chip connecting portion. The insulating layer is disposed on the metal wire, and the insulating layer has an opening to expose the contact pad. A non-conductive film is formed on the chip connecting portion and the insulating layer of an outside edge of the chip connecting portion, in which the non-conductive film is covering a portion of the metal wire. An ACF is formed on the non-conductive film of the chip connecting portion and the insulating layer of the outside edge of the chip connecting portion. The semiconductor chip is hot-pressed on the ACF to make a bump of the semiconductor chip electrically connected to the contact pad through the ACF.

"Another aspect of the present invention is to provide a semiconductor chip package structure which includes a substrate, at least a metal wire, an insulating layer, an organic insulating material, an ACF, and a semiconductor chip. The substrate has a chip connecting portion. The metal wire is disposed on the substrate and extending from outside to inside of the chip connecting portion, and the metal wire has a contact pad disposed in the chip connecting portion. The insulating layer is disposed on the metal wire, and the insulating layer has an opening to expose the contact pad. The organic insulating material is disposed on the insulating layer of an outside edge of the chip connecting portion. The ACF is covering the chip connecting portion and a portion of the organic insulating material. The semiconductor chip is disposed on the ACF of the chip connecting portion, in which a bump of the semiconductor chip is electrically connected to the contact pad through the ACF."

For additional information on this patent, see: Liu, Chi-Chao; Wang, Chih-Jui; Chen, Long-Chi. Semiconductor Chip Package Structure. U.S. Patent Number 8816483, filed April 23, 2014, and published online on August 26, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8816483.PN.&OS=PN/8816483RS=PN/8816483

Keywords for this news article include: Chunghwa Picture Tubes, Chunghwa Picture Tubes Ltd., Circuit Board, Electronics, Semiconductor.

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Source: Electronics Newsweekly


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