News Column

Patent Issued for Module Structure with Partial Pierced Substrate

September 9, 2014



By a News Reporter-Staff News Editor at Journal of Technology -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventor Jan, Shin-Dar (Hsinchu, TW), filed on November 5, 2012, was published online on August 26, 2014.

The patent's assignee for patent number 8816414 is LarView Technologies Corporation (Yangmei, Taoyuan County, TW).

News editors obtained the following quote from the background information supplied by the inventors: "A traditional camera module includes an image sensor and one or more lens set. The lens set is disposed above the image sensor for the incident ray image mapping to the image sensor. Camera module with the image sensor can be applied to digital cameras, digital video recorders, mobile phones, smart phones, monitors and others electronic products with camera function.

"For camera module, in order to ensure the image quality, it needs to strictly control the factors of affecting imaging quality to meet the requirement of higher and higher resolution of the lens module. The current design of the camera module, the image sensor chip and others active components or passive components are placed on a substrate, and therefore increasing the size and height of the module structure. And, in order to enhance the image quality and image processing speed, the number of the active components and the passive components will increase. As the space of the top surface of the original substrate is not enough to accommodate the components, it needs to increase the size of the original substrate. This is inconsistent with the requirements of the current trend of miniaturization of the electronic products.

"Therefore, based-on the shortcomings of prior arts, the present invention provide a newly module structure with a partial pierced substrate to reduce the size and height of the module structure."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventor's summary information for this patent: "Based-on the shortcomings of the above-mentioned, an objective of the present invention is to provide a holder on chip module structure by integrating active/passive components, an image sensor chip and a partial pierced substrate to reduce the size and height of the module structure.

"According to an aspect of the present invention, the present invention provides a module structure with a partial pierced substrate. The module structure comprises a substrate, having a pierced region. A main chip has a sensing area. At least one component is included, wherein the main chip and the at least one component are disposed on the pierced region of the first substrate, wherein the main chip, the at least one component and the first substrate locate at the same level. A first holder is disposed on the first substrate. A transparent material is disposed on the first holder, substantially aligning to the sensing area. A lens holder is disposed on the first holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area.

"The pierced region includes a center area and two side areas, wherein the center area is for accumulating the main chip and the two side areas are for accumulating the at least one component.

"According to another aspect of the present invention, the pierced region includes a center area and a first side area, wherein the center area is for accumulating the main chip and the first side area is for accumulating a first component of the at least one component. The at least one component includes the first component and a second component, and the second component is disposed on the top surface of a second side non-pierced region of the first substrate.

"The lens holder is a plastic piece or an actuator, wherein the actuator includes a voice coil motor or a micro electro mechanical system.

"According to another aspect of the present invention, the module structure further comprises a second substrate, wherein the main chip, the at least one component and the substrate are disposed on the first substrate."

For additional information on this patent, see: Jan, Shin-Dar. Module Structure with Partial Pierced Substrate. U.S. Patent Number 8816414, filed November 5, 2012, and published online on August 26, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8816414.PN.&OS=PN/8816414RS=PN/8816414

Keywords for this news article include: LarView Technologies Corporation, Technology.

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Source: Journal of Technology


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