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A measurement environment and formatting housing electronic components: an equipment of "wire bonding" and a test station under tip. expected...

August 9, 2014



A measurement environment and formatting housing electronic components: an equipment of "wire bonding" and a test station under tip. expected delivery date in march 2015.

Contract notice: A measurement environment and formatting housing electronic components: an equipment of "wire bonding" and a test station under tip. expected delivery date in march 2015. CEA Grenoble wishes for its site in Midi-Pyrenees, to acquire a measurement environment and development unit of electronic components consisting of the following lots - Lot 1-1 test station under manual tips for testing unit bare chips or devices on silicon wafers (wafers) in diameter up to 200 mm,- Lot 2-1 equipment for making wired interconnects for connecting bare chips in housings (bonder) versatile enough to adapt quickly and easily to different types of interconnection (wedge, ball, ribbon, bumping) and diameter and wire material running in manual or automatic mode. This contract is divided into lots: yes Time limit for receipt of tenders or requests to participate: 19.9.2014 - 16:00 Response deadline (Irish time) 10-09-2014 13:00

Major organization : CEA/GRENOBLE

Address : 17 rue des Martyrs 38054 Grenoble Cedex 9 For the attention of: Astrid Quaglino

Country :France

Email : astrid.quaglino@cea.fr

Url : www.cea.fr

Address : EA/Grenoble 17 rue des Martyrs For the attention of: Service achats Astrid Quaglino bÂt. C4 piÈce 422 38054 Grenoble Cedex 9 FRANCE Telephone: +33 438782319 E-mail: astrid.quaglino@cea.fr Fax: +33 438785053

Tender notice number : 270970-2014

Notice type : Tender Notice

Open date : 2014-09-19



Tender documents : T23358589.html


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Source: TendersInfo (India)


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