News Column

Patent Issued for Multilayer Ceramic Electronic Component

August 13, 2014



By a News Reporter-Staff News Editor at Journal of Engineering -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventors Gu, Hyun Hee (Gyunggi-do, KR); Park, Myung Jun (Gyunggi-do, KR); Lee, Kyu Ha (Gyunggi-do, KR); Choi, Da Young (Gyunggi-do, KR); Park, Jae Young (Gyunggi-do, KR); Kwon, Sang Hoon (Gyunggi-do, KR); Jeon, Byung Jun (Gyunggi-do, KR), filed on September 14, 2012, was published online on July 29, 2014.

The assignee for this patent, patent number 8792223, is Samsung Electro-Mechanics Co., Ltd. (Suwon, Gyunggi-Do, KR).

Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to a multilayer ceramic electronic component having improved reliability by preventing the permeation of a plating solution thereinto.

"In accordance with the recent trend for the miniaturization of electronic products, demand for a small multilayer ceramic electronic component having high capacitance has increased.

"In accordance with the demand for a small multilayer ceramic electronic component having high capacitance, an external electrode of the multilayer ceramic electronic component has also been thinned.

"An external electrode paste contains a conductive metal such as copper (Cu) as a main material to thereby ensure chip sealing properties and electrical conductivity between the external electrode and a chip and contains glass as an auxiliary material to provide adhesion between the external electrode and the chip while simultaneously filling voids when the metal undergoes sintering shrinkage.

"However, in the case in which a content of glass in the external electrode paste is insufficient, chip sealing properties may be ineffective. In the case of adding an excessive amount of glass to the external electrode paste in order to enhance chip sealing properties, a defect such as a plating defect may occur due to the elution of glass to a surface of the sintered external electrode.

"Particularly, in accordance with thinness of the external electrode, it may be difficult to implement a desired level of compactness, and the possibility that a defect may occur due to a lack of or an excess of glass, owing to high temperature behavior characteristics thereof, may increase.

"In addition, in the case in which a shape of the external electrode is irregular, a possibility that a plating solution may permeate through a relatively thin portion of the external electrode may be significantly increased, such that there may be a problem in securing reliability."

In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventors' summary information for this patent: "An aspect of the present invention provides a multilayer ceramic electronic component having improved reliability by preventing the permeation of a plating solution thereinto.

"According to an aspect of the present invention, there is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer in a cross-section of the ceramic body in length and thickness directions taken in a central portion of the ceramic body in a width direction is 15 .mu.m or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls.ltoreq.10 .mu.m is satisfied.

"When a thickness of the external electrode in the central portion of the ceramic body in the thickness direction is Tc and a thickness of the external electrode at a point spaced apart from a central portion of the capacitance forming part by a distance equal to 25% of a length of the ceramic body in the thickness direction is T1, T1/Tc.gtoreq.0.8 may be satisfied.

"When a thickness of the external electrode in the central portion of the ceramic body in the thickness direction is Tc and a thickness of the external electrode at the outermost point of the capacitance forming part at which the plurality of internal electrodes are formed is T2, T2/Tc.gtoreq.0.5 may be satisfied.

"The glass portions may include glass particles having an average particle diameter of 2 .mu.m or less.

"The conductive metal may be at least one selected from a group consisting of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag--Pd).

"The glass portions may have insulating properties.

"According to another aspect of the present invention, there is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer in a cross-section of the ceramic body in length and thickness directions taken in a central portion of the ceramic body in a width direction is 15 .mu.m or less, the external electrodes include a conductive metal and glass portions, and when a 50% value of cumulative distribution of areas occupied by the glass portions in the external electrodes is D50 and a 90% value of cumulative distribution of the areas is D90, 0.1.ltoreq.D50/D90.ltoreq.0.8 is satisfied.

"When a thickness of the external electrode in the central portion of the ceramic body in the thickness direction is Tc and a thickness of the external electrode at a point spaced apart from a central portion of the capacitance forming part by a distance equal to 25% of a length of the ceramic body in the thickness direction is T1, T1/Tc.gtoreq.0.8 may be satisfied.

"When a thickness of the external electrode in the central portion of the ceramic body in the thickness direction is Tc and a thickness of the external electrode at the outermost point of the capacitance forming part at which the plurality of internal electrodes are formed is T2, T2/Tc.gtoreq.0.5 may be satisfied.

"The glass portions may include glass particles having an average particle diameter of 2 .mu.m or less.

"The conductive metal may be at least one selected from a group consisting of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag--Pd).

"The glass portions may have insulating properties.

"According to another aspect of the present invention, there is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer in a cross-section of the ceramic body in length and thickness directions taken in a central portion of the ceramic body in a width direction is 15 .mu.m or less, the external electrodes include a conductive metal and glass portions, when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls.ltoreq.10 .mu.m is satisfied, and when a 50% value of cumulative distribution of areas occupied by the glass portions in the external electrodes is D50 and a 90% value of cumulative distribution of the areas is D90, 0.1.ltoreq.D50/D90.ltoreq.0.8 is satisfied.

"When a thickness of the external electrode in the central portion of the ceramic body in the thickness direction is Tc and a thickness of the external electrode at a point spaced apart from a central portion of the capacitance forming part by a distance equal to 25% of a length of the ceramic body in the thickness direction is T1, T1/Tc.gtoreq.0.8 may be satisfied.

"When a thickness of the external electrode in the central portion of the ceramic body in the thickness direction is Tc and a thickness of the external electrode at the outermost point of the capacitance forming part at which the plurality of internal electrodes are formed is T2, T2/Tc.gtoreq.0.5 may be satisfied.

"The glass portions may include glass particles having an average particle diameter of 2 .mu.m or less.

"The glass portions may have insulating properties."

For more information, see this patent: Gu, Hyun Hee; Park, Myung Jun; Lee, Kyu Ha; Choi, Da Young; Park, Jae Young; Kwon, Sang Hoon; Jeon, Byung Jun. Multilayer Ceramic Electronic Component. U.S. Patent Number 8792223, filed September 14, 2012, and published online on July 29, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8792223.PN.&OS=PN/8792223RS=PN/8792223

Keywords for this news article include: Samsung Electro-Mechanics Co. Ltd.

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Source: Journal of Engineering


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