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Patent Issued for Method for High Density Data Storage and Imaging

August 12, 2014



By a News Reporter-Staff News Editor at Information Technology Newsweekly -- A patent by the inventors Duerig, Urs T. (Rueschlikon, CH); Frommer, Jane Elizabeth (San Jose, CA); Gotsmann, Bernd Walter (Horgen, CH); Hagberg, Erik Christopher (Evansville, IN); Hedrick, James Lupton (Pleasanton, CA); Knoll, Armin W. (Zurich, CH); Lee, Victor Yee-Way (San Jose, CA); Magbitang, Teddie Peregrino (San Jose, CA); Miller, Robert Dennis (San Jose, CA); Pratt, Russell Clayton (Los Gatos, CA); Wade, Charles Gordon (Los Gatos, CA); Windeln, Johannes (Bodenheim, DE), filed on January 9, 2012, was published online on July 29, 2014, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.

Patent number 8792318 is assigned to International Business Machines Corporation (Armonk, NY).

The following quote was obtained by the news editors from the background information supplied by the inventors: "Current data storage and imaging methodologies operate in the micron regime. In an effort to store ever more information in ever smaller spaces, data storage density has been increasing. In an effort to reduce power consumption and increase the speed of operation of integrated circuits, the lithography used to fabricate integrated circuits is pressed toward smaller dimensions and more dense imaging. As data storage size increases and density increases and integrated circuit densities increase, there is a developing need for data storage and imaging methodologies that operate in the nanometer regime."

In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "A first aspect of the present invention is a method, comprising: heating a probe to at least 100.degree. C.; pushing the heated probe into a cross-linked resin layer of polyimide oligomers; and removing the probe from the resin layer, resulting in formation of a deformed region in the resin layer.

"A second aspect of the present invention is the first aspect, wherein the polyimide oligomers have the structure:

"##STR00001## wherein R' is selected from the group consisting of

"##STR00002## wherein R'' is selected from the group consisting of

"##STR00003## wherein n is an integer from about 5 to about 50.

"A third aspect of the present invention is the second aspect wherein the layer of polyimide oligomers includes a reactive diluent, the reactive diluent selected from the group consisting of:

"##STR00004## where R.sub.1, R.sub.2 and R.sub.3 are each independently selected from the group consisting of hydrogen, alkyl groups, aryl groups, cycloalkyl groups, alkoxy groups, aryloxy groups, alkylamino groups, arylamino groups, alkylarylamino groups, arylthio, alkylthio groups and

"##STR00005## wherein the polyimide oligomers are cross-linked by reactive diluent groups derived from the reactive diluent during the curing.

"A fourth aspect of the present invention is the third aspect, wherein a glass transition temperature of the resin layer with the reactive diluent groups is within about 50.degree. C. of a glass transition temperature of an otherwise identical resin layer formed without the reactive diluent groups.

"A fifth aspect of the present invention is the first aspect wherein the polyimide oligomers have the structure: E-R.sup.2A.sub.1-A.sub.2-A.sub.3- . . . -A.sub.N)-R.sup.1-R.sup.2-E; wherein E is

"##STR00006## wherein each of A.sub.1, A.sub.2, A.sub.3 . . . A.sub.N is independently selected from the group consisting of:

"##STR00007## wherein R.sup.1 is selected from the group consisting of

"##STR00008## wherein R.sup.2 is selected from the group consisting of

"##STR00009## wherein R.sup.3 is

"##STR00010## wherein N is an integer greater than or equal to 2; wherein at least one of A.sub.1, A.sub.2, A.sub.3 . . . A.sub.N is

"##STR00011## wherein at least one of A.sub.1, A.sub.2, A.sub.3 . . . A.sub.N is

"##STR00012##

"A sixth aspect of the present invention is the first aspect wherein after the curing, the resin layer is cross-linked by the reactive endgroups of the polyimide oligomers.

"A seventh aspect of the present invention is the first aspect wherein the polyimide oligomers include reactive pendent groups attached along backbones of the polyimide oligomers and after the curing, the resin layer is cross-linked by the reactive pendent groups.

"A eighth aspect of the present invention is the first aspect, wherein a glass transition temperature of the resin layer is less than about 250.degree. C.

"A ninth aspect of the present invention is the first aspect, wherein a modulus of the resin layer above a glass transition temperature of the resin layer is between about 1.5 and about 3.0 decades lower than a modulus of the resin layer below the glass transition temperature of the resin layer.

"A tenth aspect of the present invention is the first aspect, wherein the resin layer is thermally and oxidatively stable to at least 400.degree. C.

"An eleventh aspect of the present invention is the first aspect, further including: removing the resin layer in the deformed region to form an exposed region of a substrate and a region of substrate protected by the resin layer; and modifying at least a portion of the exposed region of substrate.

"A twelfth aspect of the present invention is the first aspect, further including: dragging the probe in a direction parallel to a top surface of the resin layer while heating and pushing the probe, resulting in formation of a trough in the resin layer.

"A thirteenth aspect of the present invention is the first aspect, wherein the cross-linked resin layer has a thickness between about 10 nm and about 500 nm and a thickness variation of less than about 1.0 nm across the cross-linked resin layer.

"A fourteenth aspect of the present invention is a method, comprising: heating a probe to at least 100.degree. C.; pushing the heated probe into a cross-linked resin layer of polyimide oligomers; and removing the probe from the resin layer, resulting in formation of a deformed region in the resin layer.

"A fifteenth aspect of the present invention is a data storage device, comprising: a recording medium comprising a resin layer overlying a substrate, in which topographical states of the resin layer represent data, the resin layer comprising cross-linked polyimide oligomers; and a read-write head having one or more thermo-mechanical probes, each of the thermo-mechanical probes including a resistive region locally heating a tip of the thermo-mechanical probe in response to electrical current being applied to the thermo-mechanical probe; and a scanning system for scanning the read-write head across a surface of the recording medium."

URL and more information on this patent, see: Duerig, Urs T.; Frommer, Jane Elizabeth; Gotsmann, Bernd Walter; Hagberg, Erik Christopher; Hedrick, James Lupton; Knoll, Armin W.; Lee, Victor Yee-Way; Magbitang, Teddie Peregrino; Miller, Robert Dennis; Pratt, Russell Clayton; Wade, Charles Gordon; Windeln, Johannes. Method for High Density Data Storage and Imaging. U.S. Patent Number 8792318, filed January 9, 2012, and published online on July 29, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8792318.PN.&OS=PN/8792318RS=PN/8792318

Keywords for this news article include: Information Technology, Information and Data Storage, International Business Machines Corporation.

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Source: Information Technology Newsweekly


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