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New Findings from Dublin City University in the Area of Plasma Etching Reported (Similarity ratio analysis for early stage fault detection with...

August 12, 2014



New Findings from Dublin City University in the Area of Plasma Etching Reported (Similarity ratio analysis for early stage fault detection with optical emission spectrometer in plasma etching process)

By a News Reporter-Staff News Editor at Life Science Weekly -- Research findings on Plasma Etching are discussed in a new report. According to news reporting originating in Dublin, Ireland, by NewsRx journalists, research stated, "A Similarity Ratio Analysis (SRA) method is proposed for early-stage Fault Detection (FD) in plasma etching processes using real-time Optical Emission Spectrometer (OES) data as input. The SRA method can help to realise a highly precise control system by detecting abnormal etch-rate faults in real-time during an etching process."

The news reporters obtained a quote from the research from Dublin City University, "The method processes spectrum scans at successive time points and uses a windowing mechanism over the time series to alleviate problems with timing uncertainties due to process shift from one process run to another. A SRA library is first built to capture features of a healthy etching process. By comparing with the SRA library, a Similarity Ratio (SR) statistic is then calculated for each spectrum scan as the monitored process progresses. A fault detection mechanism, named 3-Warning-1-Alarm (3W1A), takes the SR values as inputs and triggers a system alarm when certain conditions are satisfied. This design reduces the chance of false alarm, and provides a reliable fault reporting service. The SRA method is demonstrated on a real semiconductor manufacturing dataset. The effectiveness of SRA-based fault detection is evaluated using a time-series SR test and also using a post-process SR test. The time-series SR provides an early-stage fault detection service, so less energy and materials will be wasted by faulty processing."

According to the news reporters, the research concluded: "The post-process SR provides a fault detection service with higher reliability than the time-series SR, but with fault testing conducted only after each process run completes."

For more information on this research see: Similarity ratio analysis for early stage fault detection with optical emission spectrometer in plasma etching process. Plos One, 2014;9(4):e95679. (Public Library of Science - www.plos.org; Plos One - www.plosone.org)

Our news correspondents report that additional information may be obtained by contacting J. Yang, Energy and Design Lab, School of Electronic Engineering, Dublin City University, Dublin, Ireland. Additional authors for this research include C. McArdle and S. Daniels (see also Plasma Etching).

Keywords for this news article include: Dublin, Europe, Ireland, Nanotechnology, Plasma Etching, Emerging Technologies.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


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Source: Life Science Weekly


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