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Researchers Submit Patent Application, "Light Emitting Device Package and Method of Manufacturing the Same", for Approval

September 3, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors PARK, Myoung Bo (Suwon-si, KR); SONG, Ho Young (Suwon-si, KR), filed on November 13, 2013, was made available online on August 21, 2014.

The patent's assignee is Samsung Electronics Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "Devices, methods, and articles of manufacture consistent with exemplary embodiments relate to a light emitting device package and a method of manufacturing the same.

"A related art side-view type light emitting device package, of which a light emitting surface is disposed to be perpendicular to a board, includes an electrode pad disposed on a lateral surface of the package mounted on the board. To this end, an array of complicated processes of exposing a lead frame electrically connected to a light emitting device from a lateral surface of a package body and bending the exposed lead frame must be performed. Thus, the ability of reduce a package size and manufacturing costs is limited.

"In addition, in filling a reflective cup, in which a light emitting device is installed, with resin containing phosphors through a dispensing process, it is difficult to uniformly inject a predetermined amount of resin repeatedly to maintain and manage a predetermined thickness of the light emitting device. In particular, it is difficult to maintain a phosphor layer having a uniform thickness, which in turn has disadvantageous affects on color coordinate dispersion performance."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "Exemplary embodiments provide a light emitting device package having a simple structure, incurring low manufacturing costs, and having a phosphor layer having a uniform thickness, and a manufacturing method thereof.

"According to an aspect of an exemplary embodiment, there is provided a light emitting device package including a frame unit that includes at least two lead frames spaced apart from one another and a light emitting region defined by a distance therebetween; a light emitting device that is mounted on a surface of the frame unit such that the light emitting device is positioned across the light emitting region, and that is electrically connected to the at least two lead frames; a wavelength conversion unit configured to convert a wavelength of light emitted from the light emitting device and emit the light having the converted wavelength externally; and a reflective molding unit that is formed on the surface of the frame unit to cover the light emitting device.

"The wavelength conversion unit may be provided in the light emitting region and may be formed to be parallel to the surface of the frame unit and to another surface of the frame unit opposed to the surface of the frame unit.

"The reflective molding unit may be made of a resin including a reflective material.

"An outer surface of the reflective molding unit may be coplanar with a circumferential surface of the frame unit.

"An inner surface, that faces the light emitting region, of each of the at least two lead frames may be sloped away from the light emitting region from the surface on which the light emitting device is mounted to another surface opposed to the surface.

"The frame unit may further include a mounting recess that is formed in each of the at least two lead frames, the mounting recess being depressed into the lead frame and the light emitting device being mounted to the mounting recesses.

"Each of the at least two lead frames may include an extended frame portion that extends from the lead frame in an extending direction.

"The extended frame portions may be disposed to be parallel to each other with the light emitting device interposed therebetween, and the extended frame portions are not in contact with other lead frames positioned in the extending direction.

"The extended frame portions may extend parallel to each other and each of the extended frame portions may have an end portion that extends further than a width of the light emitting device interposed therebetween, and each lead frame may further include a recess that accommodates the end portion of another lead frame that extends parallel thereto.

"The end portion of each lead frame is bent toward the recess of the another lead frame that extends parallel thereto, and a portion of each recess comprises electrical insulation.

"According to an aspect of another exemplary embodiment, there is provided a method for manufacturing a light emitting device package, the method including preparing a base frame in which a plurality of frame units are arranged, each of the frame units including a first lead frame and a second lead frame that is spaced apart from the first lead frame; attaching a temporary fixing film to a lower surface of the base frame; forming a wavelength conversion unit in a light emitting region defined by a distance between the first lead frames and the second lead frames; mounting a light emitting device across the light emitting region of each frame unit, the light emitting device being mounted on portions of a surface of each of the first lead frame and the second lead frame; and forming a reflective molding unit on each frame unit to cover the light emitting device.

"The forming of the wavelength conversion unit may include filling each light emitting region with a resin containing phosphors.

"The forming of the reflective molding unit may include injecting a resin comprising a reflective material onto the base frame to cover the light emitting device, and curing the resin.

"The method may further include removing the temporary fixing film after forming the wavelength conversion unit.

"The method may further include dicing the base frame into frame units.

"According to an aspect of another exemplary embodiment, there is provided a light emitting device package including a first lead frame; a second lead frame spaced apart from the first lead frame to form a light emitting region in a gap therebetween; a light emitting device that is mounted and electrically connected to the first lead frame and to the second lead frame such that the light emitting device is positioned across the light emitting region; a wavelength conversion unit that is formed in the light emitting region and that converts a wavelength of light emitted from the light emitting device and emits the light having the converted wavelength; and a reflective molding unit that is formed on the first lead frame and the second lead frame to cover the light emitting device.

BRIEF DESCRIPTION OF THE DRAWINGS

"The above and other aspects will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

"FIG. 1 is a perspective view schematically illustrating a light emitting device package according to an exemplary embodiment;

"FIG. 2 is a cross-sectional view of the light emitting device package of FIG. 1;

"FIG. 3 is a modification of the light emitting device package of FIG. 2;

"FIG. 4 is a cross-sectional view illustrating an example of a light emitting diode (LED) chip that can be employed in an exemplary embodiment;

"FIG. 5 is a cross-sectional view illustrating another example of an LED chip that can be employed in an exemplary embodiment;

"FIG. 6 is a cross-sectional view illustrating an example of an LED chip that can be employed in another exemplary embodiment;

"FIG. 7 is a cross-sectional view illustrating an example of an LED chip as a light emitting device that can be employed in an exemplary embodiment, which is mounted on a mounting board;

"FIGS. 8A and 8B are a perspective view and a cross-sectional view illustrating a modification of the light emitting device package of FIG. 1;

"FIGS. 9A and 9B are perspective views schematically illustrating a light emitting device package according to another exemplary embodiment;

"FIG. 10 is a perspective view schematically illustrating a frame unit of the light emitting device package of FIG. 9;

"FIG. 11 is a perspective view schematically illustrating a modification of the light emitting device package of FIG. 9;

"FIGS. 12A through 16 are cross-sectional views schematically illustrating processes of a method for manufacturing a light emitting device package according to an exemplary embodiment; and

"FIGS. 17A and 17B are a plan view and a cross-sectional view schematically illustrating a backlight unit employing a light emitting device package according to an exemplary embodiment."

For additional information on this patent application, see: PARK, Myoung Bo; SONG, Ho Young. Light Emitting Device Package and Method of Manufacturing the Same. Filed November 13, 2013 and posted August 21, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4975&p=100&f=G&l=50&d=PG01&S1=20140814.PD.&OS=PD/20140814&RS=PD/20140814

Keywords for this news article include: Samsung Electronics Co. Ltd.

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Source: Electronics Newsweekly


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