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Patent Issued for Semiconductor Package Including Conductive Member Disposed between the Heat Dissipation Member and the Lead Frame

September 3, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Lim, Jae Hyun (Gyunggi-do, KR); Hong, Chang Seob (Gyunggi-do, KR); Kwak, Young Hoon (Gyunggi-do, KR); Sohn, Young Ho (Gyunggi-do, KR), filed on February 7, 2013, was published online on August 19, 2014.

The patent's assignee for patent number 8810014 is Samsung Electro-Mechanics, Co., Ltd. (Suwon, Gyunggi-Do, KR).

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a semiconductor package, and more particularly, to a semiconductor package in which the reliability of electrical connections between electronic components as well as the reliability of electrical connections between an electronic component and a lead frame is enhanced.

"A semiconductor package includes a lead frame, a power semiconductor element mounted on a lead frame and a mold part molding the exterior of respective elements with resin or the like.

"In general, a power semiconductor element mounted on a lead frame is electrically connected to a lead frame by a wire, and respective elements are also electrically connected to one another by wires.

"However, when the number of mounted power semiconductor elements is increased, the number of wires for electrically connecting the respective elements is also increased, such that the processing of wiring may be complicated, while heat is also generated due to soldering during a wire bonding process which may cause wire deformation due to the heat and wires may be disconnected due to external impacts, or the like.

"Also, when elements are connected by wires, since wires have a curved shape, elements may not be connected to one another by a significantly reduced distance therebetween, increasing inductance.

"The Related Art Document mentioned below discloses a plastic package electrically connecting a semiconductor chip and a lead frame through wire bonding."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "An aspect of the present invention provides a semiconductor package in which electronic components are electrically connected to one another by a significantly reduced distance therebetween, the snapping of wires or the thermal deformation thereof due to a soldering process are prevented, and a fabrication process is simplified, allowing for a reduction in a semiconductor package size.

"According to an aspect of the present invention, there is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a conductive member disposed between the insulating member and the lead frame and electrically connecting the electronic component to the lead frame; and a molded portion hermetically sealing the insulating member and the heat dissipation substrate.

"The lead frame may have a protrusion formed on one surface thereof, and the electronic component may be disposed in the protrusion.

"The lead frame may have a recess formed in one surface thereof, and the electronic component may be disposed in the recess.

"A plurality of the electronic components may be disposed on one surface of the lead frame, and upper surfaces of the electronic components may be positioned linearly.

"The insulating member and the electronic components may be joined by using a conductive material.

"The semiconductor package may further include a first heat sink attached to a lower side of the heat dissipation substrate.

"The semiconductor package may further include a second heat sink attached to an upper side of the insulating member.

"The molded portion may be formed of any one selected from among silicon gel, epoxy molding compound (EMC), and polyimide.

"According to another aspect of the present invention, there is provided a semiconductor package including: a lead frame having a plurality of electronic components mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; a heat dissipation member electrically joined to the plurality of electronic components and having a conductive layer formed on one surface thereof; a conductive member disposed between the heat dissipation member and the lead frame and electrically connecting the electronic component and the lead frame; and a molded portion hermetically sealing the heat dissipation member and the heat dissipation substrate, wherein upper surfaces of the plurality of electronic components are positioned linearly.

"The lead frame may include a protrusion and a recess provided on one surface thereof."

For additional information on this patent, see: Lim, Jae Hyun; Hong, Chang Seob; Kwak, Young Hoon; Sohn, Young Ho. Semiconductor Package Including Conductive Member Disposed between the Heat Dissipation Member and the Lead Frame. U.S. Patent Number 8810014, filed February 7, 2013, and published online on August 19, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8810014.PN.&OS=PN/8810014RS=PN/8810014

Keywords for this news article include: Semiconductor, Electronic Components, Samsung Electro-Mechanics Co. Ltd..

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Source: Electronics Newsweekly


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