News Column

Patent Issued for Semiconductor Device Including a Recess Formed above a Semiconductor Chip

September 3, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- Renesas Electronics Corporation (Kawasaki-shi, Kanagawa, JP) has been issued patent number 8810021, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventors are Nakashiba, Yasutaka (Kanagawa, JP); Ogawa, Kenta (Kanagawa, JP).

This patent was filed on September 15, 2012 and was published online on August 19, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "The present invention relates to a semiconductor device, which is obtained by disposing a semiconductor chip with an inductor on a mounting board and sealing it with resin, and a communication method.

"Communication between a semiconductor device and the outside is generally performed through a cable. In recent years, however, performing communication between a semiconductor device and the outside wirelessly by providing an inductor in a semiconductor chip and making the inductor inductively coupled to an external inductor has been studied.

"For example, Japanese Unexamined patent publication NO. 2003-068941 discloses mounting a semiconductor chip with an inductor on a mounting board, connecting the semiconductor chip and the mounting board to each other using a bonding wire, and sealing the semiconductor chip and the bonding wire with a magnetic resin material.

"In addition, Japanese Unexamined patent publication NO. 2007-066960 discloses embedding a heat dissipating member in an upper portion of a sealing resin layer which seals a bonding wire and a semiconductor chip on a mounting board.

"In order to improve communication precision when performing communication by inductive coupling of two inductors, it is necessary to shorten the distance between the two inductors. In the case where one inductor is provided in a semiconductor chip and this inductor and an external inductor are inductively coupled to perform communication, the distance between the two inductors is increased if a sealing resin layer which seals the semiconductor chip is made to be thick. On the other hand, if the sealing resin layer is simply made to be thin, the physical protection function required of the sealing resin layer cannot be sufficiently guaranteed."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventors' summary information for this patent: "In one embodiment, there is provided a semiconductor device including: a mounting board; a semiconductor chip disposed at a first surface of the mounting board; an inductor which is provided at a surface side of the semiconductor chip not facing the mounting board in order to perform communication between the semiconductor chip and the outside; a sealing resin layer which is formed at the first surface of the mounting board in order to seal the semiconductor chip; and a recess or an opening which is provided in the sealing resin layer and which includes the inductor inside when seen in a plan view.

"According to the embodiment of the present invention, the recess or the opening is formed in the sealing resin layer. Moreover, the physical protection function required of the sealing resin layer can be guaranteed by making the sealing resin layer to be thick in a region other than the recess or the opening. In addition, the recess or the opening includes the inductor, which is provided in the semiconductor chip, thereinside when seen in a plan view. Accordingly, by locating an external inductor, which is a communication partner of the inductor provided in the semiconductor chip, in the recess or the opening, it is possible to shorten the distance between the inductor provided in the semiconductor chip and the external inductor.

"In another embodiment, there is provided a communication method including: preparing a semiconductor device including a mounting board, a semiconductor chip disposed at a first surface of the mounting board, an inductor which is provided at a surface side of the semiconductor chip not facing the mounting board in order to perform communication between the semiconductor chip and the outside, a sealing resin layer which is formed at the first surface of the mounting board in order to seal the semiconductor chip, and a recess or an opening which is provided in the sealing resin layer and which includes the inductor inside when seen in a plan view; and performing communication between an external inductor, which is located in the recess or the opening of the semiconductor device so that the external inductor performs communication with the semiconductor device, and the inductor of the semiconductor device.

"According to the embodiments of the present invention, the distance between an inductor provided in a semiconductor chip and an external inductor can be shortened without damaging the physical protection function required of a sealing resin layer."

For the URL and additional information on this patent, see: Nakashiba, Yasutaka; Ogawa, Kenta. Semiconductor Device Including a Recess Formed above a Semiconductor Chip. U.S. Patent Number 8810021, filed September 15, 2012, and published online on August 19, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8810021.PN.&OS=PN/8810021RS=PN/8810021

Keywords for this news article include: Semiconductor, Renesas Electronics Corporation.

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Source: Electronics Newsweekly


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