News Column

Patent Issued for Resin Composition

September 3, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventor Kageyama, Yuichi (Kanagawa, JP), filed on May 17, 2012, was published online on August 19, 2014.

The assignee for this patent, patent number 8809442, is Ajinomoto Co., Inc. (Tokyo, JP).

Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to resin compositions that can be preferably used for sealing and the like of an OLED (organic light emitting diode) device.

"An OLED (organic light emitting diode) device is a luminescent device using an organic substance as a luminescence material, and is a material attracting attention in recent years since it can provide high brightness luminescence at a low voltage. However, OLED (organic light emitting diode) devices are extremely vulnerable to moisture, and are associated with problems in that the organic material itself is deteriorated by moisture to show decreased luminance, fail to emit light, the interface between electrode and OLED (organic light emitting diode) layer is detached by the influence of moisture, and the metal is oxidized to have high resistance.

"When a thermoset resin composition is used as a whole surface sealing material, advantages are that lamination work is easy since material viscosity is low before curing, and water vapor transmission of a cured product after thermal curing is low. On the other hand, however, an OLED (organic light emitting diode) device is problematically degraded by a heating temperature for thermal curing.

"JP-A-2009-524705 discloses a sealing film comprising a polyisobutylene resin and a hydrogenated cyclic olefin based polymer. While the film is generally laminated with a protective film, since the film has a high tackiness, the protective film is difficult to detach, and the handling is extremely difficult since it is markedly deformed during detachment and the like.

"On the other hand, JP-A-2008-248055 discloses a composition for a sealing material, which contains an isobutylene polymer an epoxy group-containing compound, and a curing agent for epoxy resin. However, since this composition requires hot-melt application, a sheet cannot be produced conveniently like a varnish coating. In addition, JP-A-2008-248055 is silent in regard to adhesion and handling properties, and sufficient consideration has not been conducted.

"Thus, there remains a need for resin compositions that can be used for sealing and the like of an OLED (organic light emitting diode) device which do not suffer from the above-discussed drawbacks."

In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventor's summary information for this patent: "Accordingly, it is one object of the present invention to provide novel resin compositions that can be used for sealing and the like of an OLED (organic light emitting diode) device.

"It is another object of the present invention to provide such novel resin compositions that permits varnish coating.

"It is another object of the present invention to provide such novel resin compositions which can be conveniently made into a sheet.

"It is another object of the present invention to provide such novel resin compositions which do not require thermal curing after a sealing step since it is cured in advance before the sealing step.

"It is another object of the present invention to provide such novel resin compositions which can drastically reduce heat degradation of OLED (organic light emitting diode) device.

"It is another object of the present invention to provide such novel resin compositions which can realize a sheet superior in resistance to moisture permeability, adhesion strength and handling property.

"It is another object of the present invention to provide novel resin composition sheets obtained from such a resin composition.

"It is another object of the present invention to provide novel methods of preparing an OLED (organic light emitting diode) device by sealing an OLED (organic light emitting diode) device with such a resin composition.

"It is another object of the present invention to provide novel OLED (organic light emitting diode) devices which have been prepared by such a method.

"These and other objects, which will become apparent during the following detailed description, have been achieved by the inventors' discovery that resin compositions containing a polyisobutylene resin, a polyisoprene resin and/or a polyisobutylene resin, each having a functional group capable of reacting with an epoxy group, a tackifier resin, and an epoxy resin, are useful for sealing and the like of an OLED (organic light emitting diode) device.

"Accordingly, the present invention includes the following embodiments.

"(1) A resin composition, comprising:

"(A) a polyisobutylene resin,

"(B) a polyisoprene resin and/or a polyisobutylene resin, each having a functional group capable of reacting with an epoxy group,

"(C) a tackifier resin, and

"(D) an epoxy resin.

"(2) The resin composition of the above-mentioned (1), wherein the functional group of (B) is an acid anhydride group.

"(3) The resin composition of the above-mentioned (1), wherein (A) a polyisobutylene resin is a copolymer wherein a segment backbone comprised of a monomer component other than isobutylene is copolymerized with an isobutylene polymer and/or a polyisobutylene backbone.

"(4) The resin composition of the above-mentioned (1), wherein (A) a polyisobutylene resin is a copolymer wherein a segment backbone comprised of a monomer component of styrene is copolymerized with a polyisobutylene backbone.

"(5) The resin composition of the above-mentioned (1), further comprising (E) liquid polyisobutylene and/or liquid polyisoprene.

"(6) The resin composition of the above-mentioned (1), further comprising (F) an inorganic filler.

"(7) The resin composition of the above-mentioned (1), further comprising (G) hygroscopic metal oxide.

"(8) The resin composition of the above-mentioned (1), further comprising (H) a curing agent.

"(9) A resin composition sheet comprising the resin composition of any of the above-mentioned (1)-(8).

"(10) The resin composition sheet of the above-mentioned (9), which is cured in advance before a sealing step of an OLED (organic light emitting diode) device and is used to cover the OLED (organic light emitting diode) device.

"(11) An OLED (organic light emitting diode) device comprising the resin composition sheet of the above-mentioned (9).

"(12) A production method of an OLED (organic light emitting diode) device, comprising previously curing the resin composition sheet of the above-mentioned (9) before a sealing step comprising laminating the sheet on a substrate.

"13) A resin composition sheet, comprising:

"(A) a polyisobutylene resin,

"(B) a polyisoprene resin and/or a polyisobutylene resin, each having a functional group capable of reacting with an epoxy group,

"(C) a tackifier resin, and

"(D) an epoxy resin,

"which is cured in advance before a sealing step of an OLED (organic light emitting diode) device and capable of reducing heat degradation of the OLED (organic light emitting diode) device.

"By using a resin composition containing a polyisobutylene resin, a polyisoprene resin and/or a polyisobutylene resin, each having a functional group capable of reacting with an epoxy group, a tackifier resin, and an epoxy resin, a sheet that permits varnish coating, can be conveniently made into a sheet, does not require thermal curing after a sealing step since it is cured in advance before the sealing step, can drastically reduce heat degradation of OLED (organic light emitting diode) device, and can realize a sheet superior in resistance to moisture permeability, adhesion strength and handling property can be provided."

For more information, see this patent: Kageyama, Yuichi. Resin Composition. U.S. Patent Number 8809442, filed May 17, 2012, and published online on August 19, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8809442.PN.&OS=PN/8809442RS=PN/8809442

Keywords for this news article include: Electronics, Ajinomoto Co. Inc., Light-emitting Diode.

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Source: Electronics Newsweekly


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