This patent application is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "The present disclosure relates to temperature stabilization for semiconductor devices. More particularly, the disclosure relates to semiconductor devices that incorporate magnetocaloric materials in integrated circuit chip-carrier structures for electronic packages.
"As the performance, speed, and complexity of semiconductor devices increase, the semiconductor devices tend to increasingly generate significant amounts of heat. The heat generated by operating semiconductors can lower their operating life and/or performance. In order to draw heat away from the semiconductors, various solutions have been fabricated. These include a simple passive heat sink, a forced air heat sink, or possibly a water-cooled system. However, the continually shrinking packaging containing semiconductor devices has contributed to a reduction of the ability of these devices to dissipate heat through convection and other means. The space surrounding these semiconductor devices has become significantly more confined as packaging sizes shrink, thereby reducing the opportunity for convection currents to circulate and remove heat.
"At the other end of the temperature spectrum, operating semiconductors at sub ambient temperature can also adversely affect their reliability. Operating at extreme high or low temperatures can lead to poor performance and reduced reliability."
In addition to the background information obtained for this patent application, VerticalNews journalists also obtained the inventors' summary information for this patent application: "According to an integrated circuit structure, an integrated circuit chip is provided on a substrate. The integrated circuit chip is electrically connected to the substrate. A thermostabilization unit is physically connected to the integrated circuit chip and the substrate. The thermostabilization unit comprises a temperature detector and magnetocaloric material on the integrated circuit chip. The integrated circuit structure includes a magnetic field generator operatively connected to the temperature detector. The magnetic field generator generates a magnetic field of variable intensity responsive to changes in temperature detected by the temperature detector.
"According to a method herein, a semiconductor chip is connected to a substrate. Magnetocaloric material is provided on the substrate. A temperature of the semiconductor chip is detected. A magnetic field around the substrate is controlled to adjust the temperature of the magnetocaloric material.
"According to another method herein, a semiconductor chip is connected to a substrate. A thermostabilization unit is connected to the substrate. The thermostabilization unit comprises a temperature detector, magnetocaloric material on the substrate, and a magnetic field generator operatively connected to the temperature detector. A temperature of the semiconductor chip is detected. Responsive to changes in the temperature detected by the temperature detector, the magnetic field generator generates a magnetic field of variable intensity around the substrate to adjust the temperature of the magnetocaloric material.
BRIEF DESCRIPTION OF THE DRAWINGS
"The devices and methods herein will be better understood from the following detailed description with reference to the drawings, which are not necessarily drawn to scale and in which:
"FIG. 1 is a cross-sectional view of a package structure illustrating devices and methods herein;
"FIG. 2 is a flow diagram illustrating the magnetocaloric effect;
"FIG. 3 is a graph illustrating temperature fluctuation in an integrated circuit structure; and
"FIG. 4 is a flow diagram illustrating methods herein."
URL and more information on this patent application, see: Ayotte, Stephen P.; Clore, Nicholas G.;
Keywords for this news article include: Electronics, Semiconductor,
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