This patent application is assigned to Kabushiki Kaisha Toyota Jidoshokki.
The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention relates to a solder and a die-bonding structure.
"Unlike low-temperature solder which has been already practically used, high-temperature lead-free solder is yet to be put into practical use because of many technical problems to address. In accordance with the recent development of solder technology, candidate solders of various types for lead-free capability have been proposed. Japanese Patent No. 3850135 discloses one example of solder which is made of zinc (Zn) as a main component and contains small amount of aluminum (Al) and germanium (Ge) thereby to lower the melting point of the solder. Such solder with a low melting point is used advantageously in assembling of electronic components.
"It is desired that die-bonding solder should have an improved thermal shock resistance. The present invention is directed to providing a solder that has an improved thermal shock resistance and a die-bonding structure in which the solder is used."
In addition to the background information obtained for this patent application, VerticalNews journalists also obtained the inventor's summary information for this patent application: "In accordance with the present invention, a solder includes zinc as a main component and the solder contains 6 to 8 mass percent of indium. A solder includes zinc as a main component and the solder contains only indium. In a die-bonding structure, a semiconductor chip is connected to a bonded member by a solder and the solder is made of zinc as a main component and contains indium.
"Other aspects and advantages of the invention will become apparent from the following description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
BRIEF DESCRIPTION OF THE DRAWING
"The invention together with objects and advantages thereof, may best be understood by reference to the following description of the presently preferred embodiments together with the accompanying drawings in which:
"FIG. 1 is a schematic front view showing a semiconductor device using a solder according to a preferred embodiment of the present invention."
URL and more information on this patent application, see: MAENO, Kazuhiro. Solder and Die-Bonding Structure. Filed
Keywords for this news article include: Electronics, Semiconductor, Kabushiki Kaisha Toyota Jidoshokki.
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