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United States : Nordson MARCH introduces the FlexTRAK-S Plasma System with large capacity plasma chamber for advanced semiconductor and electronics...

August 26, 2014



United States : Nordson MARCH introduces the FlexTRAK-S Plasma System with large capacity plasma chamber for advanced semiconductor and electronics packaging

Nordson MARCH, a Nordson company and global leader in plasma processing technology, extends its line of TRAK technology products with the FlexTRAK-S large-capacity plasma system for advanced semiconductor and electronic packaging. The 5.5-liter plasma chamber has a high-power RF generator and better vacuum conductance so the FlexTRAK-S performs with the same consistent plasma treatment uniformity, efficiency, and short cycle times as the smaller version. Using plasma prior to bonding, molding or marking delivers cleaner surfaces for these electronics production processes.

The FlexTRAK-S is a highly configurable, high-throughput plasma system. Its universal architecture, which remains the same even if elongated, accommodates twice as many substrates and a multitude of material handling configurations to support a wide assortment of variable-size form factors including boats, carriers, Jedec/AuerŪ boats, strips, and laminates. Depending on throughput and product form requirements, the system can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, reel-to-reel, and as a standalone for island-based production environments. It has a slim width (382 mm) that requires minimal floor space. The frame is designed so that all service components are easily accessed from the front.

The system can be configured to apply three different modes of plasma treatment: direct, downstream, and ion-free. The FlexTRAK-S SMART Tune Management System provides closed-loop plasma control that optimizes the RF system and minimizes tuning time. The system automatically recycles to a plasma-ready state, compensating for changes in vacuum pressure, temperature, and varied lot sizes. Maximum power to the chamber is achieved in seconds with a proprietary algorithm that constantly measures forward and reflective power inside the chamber.


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Source: TendersInfo (India)


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