News Column

Patent Issued for Method of Chip Mounting onto Downwardly-Facing Mounting Surface of Printed Circuit Board

August 27, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- Trinc.Org (Shizuoka-prefecture, JP) has been issued patent number 8800139, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventor is Takayanagi, Makoto (Shizuoka, JP).

This patent was filed on December 21, 2011 and was published online on August 12, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "FIG. 4 is a diagrammatic view showing the construction and operation of a conventional chip mounter. As shown in FIG. 4 a conventional chip mounter 10 mounts electronic components or chips 12 on a print-circuit board (PCB) or printed board 18 horizontally located on a bed 16 comprising, for example, a conveyer.

"The chips 12 are picked up, one at a time, from an electronic component feeding device or chip feeding device 14 in which chips are disposed at the leading end of tapes, transferred, and located in position above a printed board by a manipulator. The manipulator comprises a head 22 and a cable rack chain 24 for moving the head 22 horizontally and at the same time transferring electric power and signals. At that time, the head 22 having a moving range as shown by arrow A picks up the chip 12 at the position as shown by arrow 22a, thereafter is moved horizontally, and mounts the chip 12 on the printed board 18 at the position as shown by arrow 22b.

"Since these operations are carried out in a space above the printed board, the foreign materials 20 such as dust or the like emanated from working parts and power feeding portion of manipulator of chip mounter fall down and are accumulated on the upper surface of the printed board.

"Conventionally, since the electronic components were large in size, compared with the foreign materials 20 such as dust or the like, there was no problem. However, recently, since the electronic components are miniaturized very much, interference by the foreign materials 20 has been caused. For example, as shown in FIG. 5, when the foreign material 20 such as dust or the like which are large to a degree that interference may be caused are intervened between the electrode 12a of, for example, 0.1 mm in length of the electronic component 12 of, for example, 0.4 mm in length and the electrode 18a of, for example, 0.1 mm in length of the printed board 18, the defect in soldering would occur.

"Therefore, it is an object of the present invention to provide a chip mounter which can inhibit accumulation of the foreign materials such as dust or the like to prevent the defect in soldering."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventor's summary information for this patent: "To accomplish the object, there is provided a chip mounter which comprises a manipulator for picking up an electronic component from an electronic component feeding device, transferring the electronic component to the electronic component mounted surface of a printed board, and mounting the electronic component on the electronic component mounted surface, and a bed located above said manipulator or located sidewise relative to said manipulator for mounting said printed board vertically or downwardly.

"Other objects, features, and advantages of the present invention will be explained in the following detailed description of the invention having reference to the appended drawings:

BRIEF DESCRIPTION OF DRAWINGS

"FIG. 1 is a view showing a first embodiment of chip mounter according to the present invention,

"FIG. 2 is a view for explaining about a method in which chips are mounted on a printed board as a second embodiment of a chip mounter according to the present invention,

"FIG. 3 is a view for explaining about the second embodiment in more detail, FIG. 3a is its front view and FIG. 3b is its side view,

"FIG. 4 is a diagrammatic view showing the construction and operation of a conventional chip mounter, and

"FIG. 5 is a view for explaining about occurrence of the defect in soldering in a conventional chip mounter."

For the URL and additional information on this patent, see: Takayanagi, Makoto. Method of Chip Mounting onto Downwardly-Facing Mounting Surface of Printed Circuit Board. U.S. Patent Number 8800139, filed December 21, 2011, and published online on August 12, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8800139.PN.&OS=PN/8800139RS=PN/8800139

Keywords for this news article include: Trinc.Org, Circuit Board, Electronic Components.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Electronics Newsweekly


Story Tools






HispanicBusiness.com Facebook Linkedin Twitter RSS Feed Email Alerts & Newsletters