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Patent Issued for Frit Sealing System and Method of Manufacturing Organic Light-Emitting Display (OLED) Apparatus Using the Same

August 26, 2014



By a News Reporter-Staff News Editor at Journal of Technology -- A patent by the inventors Lee, Jung-Min (Yongin, KR); Lee, Choong-Ho (Yongin, KR), filed on October 7, 2013, was published online on August 12, 2014, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.

Patent number 8801485 is assigned to Samsung Display Co., Ltd. (Gyeonggi-do, KR).

The following quote was obtained by the news editors from the background information supplied by the inventors: "The disclosed technology relates to a frit sealing system and a method of manufacturing an organic light-emitting display (OLED) using the same.

"Many modern displays use thin film technology to make a type flat panel display (FPD). Among FPDS, an electroluminescent display apparatus is self-emissive, and has a wide viewing angle, a high-quality contrast, and a fast response time. Thus, the electroluminescent display has attracted attention as a next generation display. Also, an organic light-emitting display (OLED), including organic light-emitting layers, has enhanced luminance, driving voltage, and response time. The OLED apparatus has also a polychromatic characteristic in comparison with an inorganic light-emitting display (ILED)."

In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "One aspect of the present invention is a frit sealing system for improving an adhesive strength of a frit and a method of manufacturing an organic light-emitting display (OLED) using the frit sealing system.

"Another aspect is a frit sealing system which includes a thermal expansion film expanding when a laser is radiated on a frit to pressurize first and second substrates and bond the first and second substrates to each other, in order to improve an adhesive strength of the frit and a method of manufacturing an OLED using the same.

"Another aspect is a frit sealing system for bonding first and second substrates to each other using a frit, including: a laser radiator which radiates a laser on the frit coated between the first and second substrates; a thermal expansion film which is formed on the second substrate to pressurize the second substrate when the laser radiator radiates the laser on the frit; and a mask which is disposed on the thermal expansion film.

"An area of the thermal expansion film on which the laser is radiated may expand locally.

"The thermal expansion film may be patterned such that the thermal expansion film is not formed in an area on which the frit is coated.

"The mask may include a base which is formed of a transparent material and a metal layer which is formed on a surface of the base.

"The metal layer may be patterned to correspond to a movement path of the laser radiator.

"A portion of the laser radiated toward the second substrate may melt the frit, and an other portion of the laser may expand an area of the thermal expansion film around the frit.

"The other portion of the laser may heat the metal layer of the mask, and the heated metal layer may expand the thermal expansion film.

"The thermal expansion film may include polymer or elastomer having a relatively high thermal expansion coefficient.

"The frit sealing system may further include a pressurizer which pressurizes the mask in order to keep a fixed position of the mask when the thermal expansion film expands.

"The laser radiator may move along a trajectory corresponding to a closed curve to radiate the laser on the frit which is disposed on a surface of the first substrate in the closed curve, in order to heat the frit and expand an area of the thermal expansion film on which the laser is radiated.

"The first substrate may include a pixel area in which at least one OELD (organic electroluminescent device) including a first electrode, an organic layer, and a second electrode is formed and a non-pixel area which is formed outside the pixel area. The second substrate may be bonded to an area of the first substrate including the pixel area. The frit may be coated on an area of the non-pixel area between the first and second substrates.

"Another aspect is a method of manufacturing an organic light-emitting display (OLED) apparatus using a frit sealing system bonding first and second substrates to each other using a frit, including: coating and melting the frit on one of the first and second substrates; disposing the second substrate on the first substrate; sequentially disposing a thermal expansion film and a mask on the second substrate; and radiating a laser on the second substrate to harden the frit and expand the thermal expansion film in order to pressurize the second substrate.

"An area of the thermal expansion film on which the laser is radiated may expand locally.

"The radiation of the laser on the second substrate may include: leading a portion of the laser radiated toward the second substrate to melt the frit; and leading an other portion of the laser to expand the thermal expansion film around the frit.

"The mask may include a base formed of a transparent material and a metal layer formed on a surface of the base. The leading of the other portion of the laser to expand the thermal expansion film may include leading the other portion of the laser to heat the metal layer of the mask and leading the heated metal layer to expand the thermal expansion film.

"The radiation of the laser on the second substrate may further include pressurizing the mask to keep a fixed position of the mask when the thermal expansion film expands.

"Another aspect is a frit sealing system for bonding first and second substrates to each other using a frit, comprising: a thermal expansion film formed on the second substrate to pressurize the second substrate when heat is applied to the frit and thermal expansion film, wherein the frit is interposed between the first and second substrates; and a mask formed on the thermal expansion film.

"In the above system, at least part of an area of the thermal expansion film to which the heat is applied expands. In the above system, a plurality of openings are formed in the thermal expansion film, and wherein the openings are formed substantially directly above the frit. The above system further comprises a laser radiator configured to apply a laser beam to the frit through the mask, the thermal expansion film and the second substrate. In the above system, the mask comprises i) a base which is formed of a transparent material and ii) a metal layer which is formed on a surface of the base. In the above system, a plurality of openings are formed in the metal layer along a movement path of the laser radiator. In the above system, the laser radiator is configured to melt the frit and expand an area of the thermal expansion film around the frit.

"In the above system, the laser radiator is configured to heat the metal layer of the mask, and wherein the heated metal layer is configured to expand the thermal expansion film. In the above system, the laser radiator is configured to move along a trajectory corresponding to a closed curve and radiate the laser on the frit which is formed on a surface of the first substrate in the closed curve, in order to heat the frit and expand an area of the thermal expansion film on which the laser is radiated. In the above system, the thermal expansion film is formed of at least one of polymer and elastomer having relatively high thermal expansion coefficients. The above system further comprises a pressurizer configured to pressurize the mask in order to prevent the mask from moving when the thermal expansion film expands.

"In the above system, the first substrate comprises i) a pixel area and ii) a non-pixel area which is formed outside the pixel area, wherein the pixel area comprises at least one organic electroluminescent device which includes a first electrode, an organic layer, and a second electrode is formed, wherein the second substrate is bonded to an area of the first substrate comprising the pixel area, and wherein the frit is formed on the non-pixel area between the first and second substrates.

"Another aspect is a method of manufacturing an organic light emitting display apparatus using a frit sealing system bonding first and second substrates to each other using a frit, comprising: forming the frit on one of the first and second substrates; forming the second substrate on the first substrate; forming a thermal expansion film on the second substrate; and forming a mask on the thermal expansion film; applying heat to the second substrate and the thermal expansion film to harden the frit so that at least part of the thermal expansion film expands by the heat and pressurizes the second substrate.

"In the above method, the second substrate is heated by radiation of a laser. In the above method, the radiation of the laser on the second substrate and the thermal expansion film comprises: first radiating a portion of the laser toward the second substrate to melt the frit; and second radiating another portion of the laser to expand the thermal expansion film around the frit. In the above method, the mask comprises a base formed of a transparent material and a metal layer formed on a surface of the base, and wherein the second radiating comprises heating the metal layer of the mask so that the heated metal layer expands the thermal expansion film. The above method further comprises pressurizing the mask to prevent the mask from moving when the thermal expansion film expands.

"Another aspect is a frit sealing system for bonding first and second substrates to each other using a frit interposed between the substrates, the system comprising: a thermal expansion layer formed on the second substrate and configured to expand so as to pressurize the second substrate when heat is applied to the thermal expansion layer, the second substrate and the frit.

"The above system further comprises a mask formed on the thermal expansion layer, wherein the mask is configured to receive and transfer the heat to the thermal expansion layer. In the above system, a plurality of openings are formed in the thermal expansion layer and wherein the openings are formed substantially directly above the frit."

URL and more information on this patent, see: Lee, Jung-Min; Lee, Choong-Ho. Frit Sealing System and Method of Manufacturing Organic Light-Emitting Display (OLED) Apparatus Using the Same. U.S. Patent Number 8801485, filed October 7, 2013, and published online on August 12, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8801485.PN.&OS=PN/8801485RS=PN/8801485

Keywords for this news article include: Technology, Samsung Display Co. Ltd..

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Source: Journal of Technology


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