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Patent Issued for Integrated Inertial Sensing Apparatus Using MEMS and Quartz Configured on Crystallographic Planes

August 20, 2014



By a News Reporter-Staff News Editor at Journal of Engineering -- mCube Inc. (San Jose, CA) has been issued patent number 8794065, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventor is Yang, Xiao "Charles" (Cupertino, CA).

This patent was filed on February 26, 2011 and was published online on August 5, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "The present invention relates generally to integrated devices. More particularly, the present invention provides a system and method for integrating at least two different micro electro mechanical systems (MEMS), which may optionally include one or more complementary metal oxide semiconductor (CMOS) devices, but can have others as well. Merely by way of example, the MEMS devices can include at least an accelerometer, a gyroscope, a magnetic sensor, a pressure sensor, a microphone, a humidity sensor, a temperature sensor, a chemical sensor, a biosensor, an inertial sensor, and others. But it will be recognized that the invention has a much broader range of applicability.

"Research and development in integrated microelectronics have continued to produce astounding progress in CMOS and MEMS. CMOS technology has become the predominant fabrication technology for integrated circuits (IC). MEMS, however, continues to rely upon conventional process technologies. In layman's terms, microelectronic ICs are the 'brains' of an integrated device which provides decision-making capabilities, whereas MEMS are the 'eyes' and 'arms' that provide the ability to sense and control the environment. Some examples of the widespread application of these technologies are the switches in radio frequency (RF) antenna systems, such as those in the iPhone.TM. device by Apple, Inc. of Cupertino, Calif., and the Blackberry.TM. phone by Research In Motion Limited of Waterloo, Ontario, Canada, and accelerometers in sensor-equipped game devices, such as those in the Wii.TM. controller manufactured by Nintendo Company Limited of Japan. Though they are not always easily identifiable, these technologies are becoming ever more prevalent in society every day.

"Beyond consumer electronics, use of IC and MEMS has limitless applications through modular measurement devices such as accelerometers, gyroscopes, actuators, and sensors. In conventional vehicles, accelerometers and gyroscopes are used to deploy airbags and trigger dynamic stability control functions, respectively. MEMS gyroscopes can also be used for image stabilization systems in video and still cameras, and automatic steering systems in airplanes and torpedoes. Biological MEMS (Bio-MEMS) implement biosensors and chemical sensors for Lab-On-Chip applications, which integrate one or more laboratory functions on a single millimeter-sized chip only. Other applications include Internet and telephone networks, security and financial applications, and health care and medical systems. As described previously, ICs and MEMS can be used to practically engage in various type of environmental interaction.

"Although highly successful, ICs and in particular MEMS still have limitations. Similar to IC development, MEMS development, which focuses on increasing performance, reducing size, and decreasing cost, continues to be challenging. Additionally, applications of MEMS often require increasingly complex microsystems that desire greater computational power. Unfortunately, such applications generally do not exist. These and other limitations of conventional MEMS and ICs may be further described throughout the present specification and more particularly below.

"From the above, it is seen that techniques for improving operation of integrated circuit devices and MEMS are highly desired."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventor's summary information for this patent: "According to the present invention, techniques related generally to electronic and mechanical devices are provided. More particularly, the present invention provides an inertial sensing apparatus that is preferably integrated with one or more integrated circuits and/or other micro-electrical mechanical systems, commonly termed MEMS. Merely by way of example, the MEMS devices can include at least an accelerometer, a gyroscope, a magnetic sensor, a pressure sensor, a microphone, a humidity sensor, a temperature sensor, a chemical sensor, a biosensor, an inertial sensor, and others. Additionally, the other applications include at least a sensor application or applications, system applications, and broadband applications, among others. But it will be recognized that the invention has a much broader range of applicability.

"In a specific embodiment, the present invention provides an apparatus for inertial sensing, e.g., an integrated gyroscope and accelerometer device. The apparatus includes a substrate member including a thickness of material. In an embodiment, the apparatus also has a first surface region configured from a first crystallographic plane of the substrate and a second plane region configured from a second crystallographic plane of the substrate. The apparatus has a quartz inertial sensing device coupled to the first surface region, and one or more MEMS inertial sensing devices coupled to the second plane region. Of course, there can be other variations, modifications, and alternatives.

"Many benefits are achieved by way of the present invention over conventional techniques. For example, the present technique provides an easy to use process that relies upon conventional technology. In some embodiments, the method provides higher device yields in dies per wafer with the integrated approach. Additionally, the method provides a process and system that are compatible with conventional process technology without substantial modifications to conventional equipment and processes. Preferably, the invention provides for an improved CMOS integrated circuit device and related methods for a variety of uses. In one or more preferred embodiments, the present invention uses micro-machining techniques, such as those commonly used in the manufacture of MEMS and/or semiconductor devices. Depending upon the embodiment, one or more of these benefits may be achieved. These and other benefits will be described in more throughout the present specification and more particularly below.

"Various additional objects, features and advantages of the present invention can be more fully appreciated with reference to the detailed description and accompanying drawings that follow."

For the URL and additional information on this patent, see: Yang, Xiao "Charles". Integrated Inertial Sensing Apparatus Using MEMS and Quartz Configured on Crystallographic Planes. U.S. Patent Number 8794065, filed February 26, 2011, and published online on August 5, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8794065.PN.&OS=PN/8794065RS=PN/8794065

Keywords for this news article include: Quartz, mCube Inc, Biosensing, Electronics, Semiconductor, Bioengineering, Silicon Dioxide, Bionanotechnology, Nanobiotechnology.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


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Source: Journal of Engineering


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