News Column

Patent Application Titled "LED Light Source" Published Online

August 21, 2014



By a News Reporter-Staff News Editor at Politics & Government Week -- According to news reporting originating from Washington, D.C., by VerticalNews journalists, a patent application by the inventor Li, Changxing (Guizhou, CN), filed on June 21, 2012, was made available online on August 7, 2014.

The assignee for this patent application is Chongqing Shangchuan Investments Co.,ltd.

Reporters obtained the following quote from the background information supplied by the inventors: "With development of electrical technology, heat dissipation problem has been already to become an important factor to restrict the improvement of device power and product life.

"Particularly, the advantages of LED used as a new environmental friendly light source are more significantly, but heat dissipation of intense light source of LED functional lighting is an unsolved worldwide technical problem, so that impeding the applications of LED functional lighting as intense light source. For example, the promotion of high-power LED light source, such as automobile lamps, large-scale LED light source for steamship, LED street lamp, and searchlight etc., are more constrained by the heat dissipation."

In addition to obtaining background information on this patent application, VerticalNews editors also obtained the inventor's summary information for this patent application: "The first object of the embodiment according to the present utility mode is to provide a LED light source with a good heat-dissipation performance, particularly to be used for high-power LED illumination.

"The second object of the embodiment according to the present utility mode is to provide another LED light source having a good heat-dissipation performance, particularly to be used for high-power LED illumination.

"A LED light source according to a first embodiment of the present utility mode, comprising a heat-dissipation base,

"a circuit base is fixed on the heat-dissipation base, and luminous LED(s) is fixed on the circuit base,

"a light-distribution lens is sealed connected outside the heat-dissipation base, a housing is fixed outside the light-distribution lens, and front ends of the housing and the light-distribution lens are separately fixed jointed to a light-transmitting cover,

"the light-transmitting cover is sealed connection with the heat-dissipation base, the circuit base and LEDs are located within a sealed first chamber formed by the heat-dissipation base, light-distribution lens and light-transmitting cover,

"at least a channel is further arranged on the heat-dissipation base, each channel is disconnected to the first chamber, and two opposite openings of each channel are connected to the exterior.

"Optionally, the channels are tubular channels formed in the heat-dissipation base; or

"a plurality of fins are formed on surface of the heat-dissipation base,

"the channels are grooved channels between any two adjacent fins.

"Optionally, rear end of the heat-dissipation is extended outside rear end of the housing, an opening of each channel is located outside the rear end of the housing.

"Optionally, all parts of the heat-dissipation base are located on one side of the light-transmitting cover,

"at least a through hole is arranged on periphery of connection part of the light-transmitting cover and the heat-dissipation base,

"each through hole is opposite to the opening of each channel on the heat-dissipation base.

"Optionally,

"A LED light source according to a second embodiment of the present utility mode,

"Optionally, the heat-dissipation base is extended outside the light-transmitting cover,

"at least a through hole is arranged on periphery of connection part of the light-transmitting cover and the heat-dissipation base,

"part of the heat-dissipation is cut through the through hole of the light-transmitting cover and extended outside the light-transmitting cover,

"an opening of each channel on the heat-dissipation base is located outside the light-transmitting cover.

"Optionally, two opposite chimbs are further arranged on the connection part of the light-transmitting cover and the heat-dissipation base ;

"the light-transmitting cover is sealed connected with the heat-dissipation base, that is:

"the connection part of is spacing sealed fixed between two chimbs of the light-transmitting cover.

"Optionally, a first chimb is arranged on the connection part of the housing and the light-distribution lens on the light-transmitting cover,

"the front ends of the housing and the light-distribution lens are separately fixed to the light-transmitting cover, that is:

"the housing is face-to-face sealed fixed on outer side of the first chimb of the light-transmitting cover,

"the light-distribution lens is face-to-face sealed fixed on inner side of the first chimb.

"Optionally, the circuit base comprising: metal substrate, insulated-based material, and routing copper foil;

"the LEDs are LED chips, and each LED chip is fixed on the surface of the metal substrate,

"a insulated layer at the bottom surface of each LED chip is face-contacted with the metal substrate,

"an electrode pin of each LED chip is welded on the metal substrate, and another electrode pin is electrically connected with the routing copper foil lay in the insulated-based material via lead;

"wherein, the PCB insulated-based material is lay on the top surface of the metal substrate except the LED chip fixed area, the routing copper foil is lay in the PCB insulated-based material;

"the metal substrate and the routing copper foil are separately electrically connected with anode and cathode of an external supply circuit.

"Optionally, a pit is further arranged on the top surface of the metal substrate,

"the LED chips are fixed on the surface of the metal substrate, that is: the LED chips are fixed on the surface of the pit,

"the PCB insulated-based material is lay on the top surface of the metal substrate except the LED chip fixed area, that is:

"the insulated layer is lay on the top surface area of the metal substrate except the pit area;

"another electrode pin of each LED chip is electrically connected with the routing copper foil, that is: another electrode pin of each LED chip is electrically connected with the routing copper foil via the lead;

"a silica gel filled part is filled in the pit, and all of the LED chips and leads are packed in the silica gel filled part.

"A LED light source according to an embodiment of the present utility mode, comprising: a heat-dissipation base,

"circuit bases are separately fixed on top and bottom surfaces of the heat-dissipation base, and luminous LED(s) is fixed on each circuit base;

"a light-distribution lens is sleeve connected outside the heat-dissipation, a housing is sleeve connected outside the light-distribution lens, the front ends of the housing and light-distribution lens are separately fixed on the light-transmitting cover;

"the circuit base located on the top surface of the heat-dissipation base and the LED are located within a first sealed chamber formed by the light-distribution lens, heat-dissipation base and light-transmitting cover,

"the circuit base located on the bottom surface of the heat-dissipation base and the LED are located within a second sealed chamber formed by the light-distribution lens, heat-dissipation base and light-transmitting cover,

"at least a tubular channel is further arranged within the heat-dissipation base, and two opposite openings of each channel are connected to the exterior.

"Optionally, the rear end of the heat-dissipation base is extended outside the rear end of the housing,

"an opening of each channel is located outside the rear end of the housing.

"Optionally, all parts of the heat-dissipation base are located on one side of the light-transmitting cover,

"at least a through hole is arranged on the light-transmitting cover, and each through hole is opposite to the opening of each channel on the heat-dissipation base.

"Optionally, the heat-dissipation base is extended outside the light-transmitting cover,

"through hole(s) is arranged on periphery of connection part of the light-transmitting cover and the heat-dissipation base,

"part of the heat-dissipation is cut through the through hole of the light-transmitting cover and extended outside the light-transmitting cover,

"an opening of each channel on the heat-dissipation base is located outside the light-transmitting cover.

"Optionally, two opposite chimbs are further arranged on the connection part of the light-transmitting cover and the heat-dissipation base; the light-transmitting cover is sealed connected with the heat-dissipation base, that is:

"the connection part of the light-transmitting cover and the heat-dissipation base is spacing sealed fixed between two chimbs of the light-transmitting cover.

"Optionally, a first chimb is arranged on the connection part of the housing and the light-distribution lens on the light-transmitting cover,

"the front ends of the housing and the light-distribution lens are separately fixed to the light-transmitting cover, that is :

"the housing is face-to-face sealed fixed on outer side of the first chimb of the light-transmitting cover,

"the light-distribution lens is face-to-face sealed fixed on inner side of the first chimb.

"Optionally, the circuit base comprising: metal substrate, insulated-based material, and routing copper foil;

"the LEDs are LED chips which are fixed on the surface of the metal substrate,

"a insulated layer at the bottom surface of each LED chip is face-contacted with the metal substrate,

"an electrode pin of each LED chip is welded on the metal substrate, and another electrode pin is electrically connected with the routing copper foil lay in the insulated-based material via lead;

"wherein, the insulated-based material is lay on the top surface of the metal substrate except the LED chip fixed area, the routing copper foil is lay in the insulated-based material;

"the metal substrate and the routing copper foil are separately electrically connected with anode and cathode of an external supply circuit.

"Optionally, a pit is further arranged on the top surface of the metal substrate,

"the LED chips are fixed on the surface of the metal substrate, that is: the LED chips are fixed on the surface of the pit,

"the insulated-based material is lay on the top surface of the metal substrate except the LED chip fixed area, that is:

"the insulated layer is lay on the top surface area of the metal substrate except the pit area;

"another electrode pin of each LED chip is electrically connected with the routing copper foil, that is: another electrode pin of each LED chip is electrically connected with the routing copper foil via the lead;

"a silica gel filled part is filled in the pit, and all of the LED chips and leads are packed in the silica gel filled part.

"It can be seen that when apply the technical solution according to the embodiment of the present utility mode, turning on the external power supply which is supplied to each LED via the circuit base, then the LEDs are driven by electricity and lighten to exterior. Heat produced during the working process of LEDs is fast transmitted to the heat-dissipation base connected thereto through the circuit base; the fluid, such as air or liquid entering into an opening of the channel arranged in the heat-dissipation base, passing through the heat-dissipation base and fully contacted with the heat-dissipation base, and then taking the heat on the heat-dissipation base away from another opening of the channel, which can achieve cut-through heat dissipation of the fluid and improve the heat dissipation rate of the LED intense light source. According to the experiments, the embodiment of the present utility mode can achieve a LED high-power light source with super power, whose power may be up to thousands of watts.

"In addition, when both openings of each channel are opposite each other, the fluid passed through the channel is entered into one end and fast to flow out of another end, which taking heat of the heat-dissipation base away so as to achieve efficient heat dissipation.

"Furthermore, since the channel(s) arranged within the heat-dissipation base is not connected to the first chamber, the fluid passed through does not enter into main electric devices to affect the electrical property.

BRIEF DESCRIPTION OF THE DRAWINGS

"The appended drawings intend to help further understanding of the utility mode, and constitute part of the application, which shall not be construed as improper limitations on the utility mode. In the appended drawings:

"FIG. 1 is a structural schematic view of a LED light source with a heat-dissipation device according to a first embodiment of the present utility mode;

"FIG. 2 is an A-A direction sectional view of FIG. 1 according to the first embodiment of the present utility mode;

"FIG. 3 is a sectional structure schematic view of LED light source with a heat-dissipation base whose rear end is extended outside the rear end of the housing according to the first embodiment of the present utility mode;

"FIG. 4 is a sectional structure schematic view of LED light source with a heat-dissipation base whose front end is extended outside the light-transmitting cover according to the first embodiment of the present utility mode;

"FIG. 5 is a schematic view of connection structure of circuit base for fixing LED and LED arranged thereon according to the first embodiment of the present utility mode;

"FIG. 6 is a schematic view of another connection structure of circuit base for fixing LED and LED arranged thereon according to the first embodiment of the present utility mode;

"FIG. 7 is a sectional structure schematic view of a LED light source with a heat-dissipation device according to a second embodiment of the present utility mode;

"FIG. 8 is a sectional structure schematic view of a LED light source with a heat-dissipation device according to a third embodiment of the present utility mode."

For more information, see this patent application: Li, Changxing. LED Light Source. Filed June 21, 2012 and posted August 7, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4204&p=85&f=G&l=50&d=PG01&S1=20140731.PD.&OS=PD/20140731&RS=PD/20140731

Keywords for this news article include: Chemicals, Chemistry, Silica Gel, Chongqing Shangchuan Investments Co. ltd.

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