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Investigators at Middle East Technical University Discuss Findings in Sensor Research (A parylene coating based room temperature wafer-level...

August 19, 2014



Investigators at Middle East Technical University Discuss Findings in Sensor Research (A parylene coating based room temperature wafer-level attachment method for MEMS integration with zero applied force)

By a News Reporter-Staff News Editor at Journal of Technology -- Investigators publish new report on Sensor Research. According to news originating from Ankara, Turkey, by VerticalNews correspondents, research stated, "This paper reports a wafer-level attachment method using parylene as an interlayer material for integrating various shaped and fragile substrates into MEMS processes. In the proposed method, the substrates are placed on a handle wafer containing pillars and perforations, and coated with a standard parylene deposition process realized at room temperature, with no applied force."

Our news journalists obtained a quote from the research from Middle East Technical University, "The substrate and the handle wafer are attached to each other via formation of a parylene interlayer. Only poor attachment is observed by utilizing a handle wafer containing pillars alone, as parylene cannot perfectly penetrate through the structures. The parylene penetration is significantly improved by introducing perforations to the handle wafer. It is experimentally shown that, with a perforated handle wafer containing pillar structures having 20 mu m height and 4.5 mm spacing, parylene completely fills the gap between the structures, and can successfully be used to attach substrates to each other. The shear strength between the attached substrates has been measured as 0.49 MPa, proving the feasibility of the method for integrating various materials into MEMS processes."

According to the news editors, the research concluded: "As a demonstrator for the utilization of the attachment method in the microfabrication processes of sensors and actuators, a fragile 7 cm x 7 cm x 190 mu m PZT sheet has been attached to a handle wafer and processed successfully through a sample set of standard MEMS processes."

For more information on this research see: A parylene coating based room temperature wafer-level attachment method for MEMS integration with zero applied force. Sensors and Actuators A-Physical, 2014;215():1-7. Sensors and Actuators A-Physical can be contacted at: Elsevier Science Sa, PO Box 564, 1001 Lausanne, Switzerland.

The news correspondents report that additional information may be obtained from L. Beker, Middle East Technical University, Dept. of Elect & Elect Engn, TR-06531 Ankara, Turkey. Additional authors for this research include O. Zorlu and H. Kulah.

Keywords for this news article include: Ankara, Turkey, Eurasia, Sensor Research

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


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Source: Journal of Technology


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