News Column

"Semiconductor Package" in Patent Application Approval Process

August 20, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- A patent application by the inventor PARK, JI-WOON (Yongin-si, KR), filed on March 13, 2013, was made available online on August 7, 2014, according to news reporting originating from Washington, D.C., by VerticalNews correspondents.

This patent application is assigned to Samsung Electronics Co., Ltd.

The following quote was obtained by the news editors from the background information supplied by the inventors: "The present inventive concept relates to a semiconductor package. In particular, the present inventive concept relates to a multi-chip semiconductor package in which a plurality of chips are stacked one atop the other.

"One way to meet current demand for compact and high-capacity semiconductor-based products is to provide a highly integrated semiconductor chip. However, today's integration techniques impose limits on the degree to which a semiconductor chip can be integrated without otherwise incurring enormous expenses. Therefore, a multi-chip type of semiconductor package, in which electrically connected semiconductor chips are stacked and united in a single package, has been developed.

"However, as the number of stacked semiconductor chips to be provided in a multi-ship semiconductor package increases, it becomes more and more difficult to connect (the signals lines of) the semiconductor chips. One means used to facilitate the electrical connection of a large number of stacked semiconductor devices is a redistribution layer (RDL)."

In addition to the background information obtained for this patent application, VerticalNews journalists also obtained the inventor's summary information for this patent application: "There is provided a semiconductor package comprising a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, redistribution lines constituting an RDL structure extending on the first semiconductor chip, and at least one redistribution wire disposed on the first semiconductor chip and electrically connecting a plurality of the redistribution lines to one another.

"The redistribution lines provide conductive paths, respectively, each of which electrically connects the first semiconductor chip to the second semiconductor chip independently of the other.

"According to another aspect of the inventive concept, the redistribution lines include a plurality of first redistribution lines electrically connecting the first semiconductor chip to the second semiconductor chip to supply a first voltage to the first semiconductor chip, a plurality of second redistribution lines electrically connected to the second semiconductor chip to supply the first voltage to the second semiconductor chip, and a plurality of third redistribution lines electrically connected to the second semiconductor chip to supply the first voltage to the second semiconductor chip, and a plurality of the redistribution wires are provided. The redistribution wires include a first redistribution wire electrically connecting one of the first redistribution lines to another of the first redistribution lines, a second redistribution wire electrically connecting one of the second redistribution lines to another of the second redistribution lines, and third redistribution wires electrically connecting the first redistribution line, the second redistribution line and the third redistribution line to one another.

"According to another aspect of the present inventive concept, there is provided a semiconductor device comprising a first semiconductor chip including a first chip body having an upper surface at the top of the device, a second semiconductor chip stacked on the first semiconductor chip so as to also be located at the top of the device and including a second chip body adhered to the first chip body, redistribution lines extending over the upper surface of the first chip body, and at least one redistribution wire running alongside the upper surface of the first chip body. The redistribution lines provide conductive paths, respectively, each of which paths electrically connects the first semiconductor chip to the second semiconductor chip independently of the other, and each redistribution wire electrically connects two of the redistribution lines to one another.

BRIEF DESCRIPTION OF THE DRAWINGS

"The above and other features and advantages of the present inventive concept will become more apparent with reference to the detail description that follows of preferred embodiments thereof made with reference to the attached drawings in which:

"FIG. 1 is a perspective view of a first embodiment of a semiconductor package according to the present inventive concept;

"FIGS. 2 and 4 are side views of the semiconductor package shown in FIG. 1;

"FIG. 3 is a plan view of the semiconductor package shown in FIG. 1;

"FIG. 5 is a plan view of a second embodiment of a semiconductor package according to the present inventive concept;

"FIG. 6 is a plan view of a third embodiment of a semiconductor package according to the present inventive concept;

"FIG. 7 is a plan view of a fourth embodiment of a semiconductor package according to the present inventive concept;

"FIG. 8 is a plan view of a fifth embodiment of a semiconductor package according to the present inventive concept;

"FIG. 9 is a plan view of a sixth embodiment of a semiconductor package according to the present inventive concept;

"FIG. 10 is a plan view of a seventh embodiment of a semiconductor package according to the present inventive concept; and

"FIGS. 11 and 12 each illustrate an example of an application of a semiconductor package according to the present inventive concept."

URL and more information on this patent application, see: PARK, JI-WOON. Semiconductor Package. Filed March 13, 2013 and posted August 7, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5564&p=112&f=G&l=50&d=PG01&S1=20140731.PD.&OS=PD/20140731&RS=PD/20140731

Keywords for this news article include: Semiconductor, Samsung Electronics Co. Ltd..

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


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Source: Electronics Newsweekly


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