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Researchers Submit Patent Application, "Multilayer Ceramic Capacitor, Manufacturing Method Therefor, Circuit Board Having Multilayer Ceramic...

August 20, 2014



Researchers Submit Patent Application, "Multilayer Ceramic Capacitor, Manufacturing Method Therefor, Circuit Board Having Multilayer Ceramic Capacitor Embedded Therein, and Polishing Device for Multilayer Ceramic Capacitor", for Approval

By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors OH, Deok Seok (Suwon, KR); CHAE, Eun Hyuk (Suwon, KR); JEON, Jung Hyun (Suwon, KR); JUNG, Jin Man (Suwon, KR), filed on June 26, 2013, was made available online on August 7, 2014.

No assignee for this patent application has been made.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a multilayer ceramic capacitor, a manufacturing method therefor, a circuit board having a multilayer ceramic capacitor embedded therein, and a polishing device for a multilayer ceramic capacitor.

"In accordance with high densification and high integration of electronic circuits, mounting spaces for passive devices on printed circuit boards have become insufficient. In order to solve this problem, efforts aimed at implementing a component to be embedded in a circuit board, that is, an embedded device, have been undertaken. Particularly, methods of embedding a multilayer ceramic capacitor used as a capacitive component in the board have been variously suggested.

"As a method of embedding the multilayer ceramic capacitor in the board, there is provided a method of using a dielectric material for a multilayer ceramic electronic component as a material of the board and using copper wiring, or the like, as an electrode for the multilayer ceramic electronic component. In addition, as another method of implementing a multilayer ceramic capacitor to be embedded in the board, there is provided a method of forming a high-k polymer sheet or a dielectric thin film in the board to form a board-embedded multilayer ceramic capacitor and a method of embedding a multilayer ceramic capacitor in the board.

"Generally, a multilayer ceramic capacitor includes a plurality of dielectric layers formed of a ceramic material and internal electrodes interposed therebetween. The multilayer ceramic electronic component as described above is positioned within the board, such that a multilayer ceramic capacitor to be embedded in the board and having high capacitance may be implemented.

"However, in the case of the multilayer ceramic capacitor to be embedded in the board, the multilayer ceramic capacitor has a smaller thickness than a length and a width thereof in order to be easily embedded. Generally, in order to prevent a chipping defect occurring when ceramic bodies impact each other to be broken in a manufacturing process, edge and vertex portions of the ceramic body should be polished. However, in the case of the ceramic body having a thin thickness, it may not be easy to polish the ceramic body, and non-uniform polishing may occur. Further, in the case in which the polishing is excessively or insufficiently performed, reliability of the multilayer ceramic electronic component may be affected.

"Therefore, optimized dimensions for polishing the multilayer ceramic electronic component, and a method for polishing the multilayer ceramic electronic component have been required."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "An aspect of the present invention provides a multilayer ceramic capacitor, a manufacturing method therefor, a circuit board having a multilayer ceramic capacitor embedded therein, and a polishing device for a multilayer ceramic capacitor.

"According to an embodiment of the present invention, there is provided a multilayer ceramic capacitor including: a 0603-sized ceramic body including a dielectric layer and a cover layer; first and second internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode, wherein in a length-thickness (L-T) cross-section of the ceramic body, in the case in which a square is defined as including sides parallel to a central portion of a first main surface of the ceramic body, and vertices disposed in a diagonal direction on outer surfaces of the ceramic body, the sides having a length of 30 .mu.m, when an area of a region of the square not occupied by the ceramic body is defined as A-out and a thickness of the cover layer is defined as t, the following Equations are satisfied: 10 .mu.m.sup.2.ltoreq.A-out and A-out/t.ltoreq.3.5 m.

"The ceramic body may have a thickness of 0.12 mm or less after firing.

"The cover layer may include upper and lower cover layers, and the thickness t of the cover layer may be an average of thicknesses of the upper and lower cover layers.

"According to another embodiment of the present invention, there is provided a circuit board having a multilayer ceramic capacitor embedded therein, the circuit board including: a circuit board part provided with a groove for receiving an electronic component; and a multilayer ceramic capacitor including a 0603-sized ceramic body including a dielectric layer and a cover layer; first and second internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode, and disposed in the groove, wherein in a length-thickness (L-T) cross-section of the ceramic body, in the case in which a square is defined as including sides parallel to a central portion of a first main surface of the ceramic body, and vertices disposed in a diagonal direction on outer surfaces of the ceramic body, the sides having a length of 30 .mu.m, when an area of a region of the square not occupied by the ceramic body is defined as A-out and a thickness of the cover layer is defined as t, the following Equations are satisfied: 10 .mu.m.sup.2.ltoreq.A-out and A-out/t.ltoreq.3.5 m.

"According to another embodiment of the present invention, there is provided a manufacturing method for a multilayer ceramic capacitor, the manufacturing method including: preparing ceramic green sheets; forming internal electrode patterns on the ceramic green sheets using a conductive paste for an internal electrode; forming a 0603-sized ceramic body including first and second internal electrodes disposed to face each other, a dielectric layer, and a cover layer therein, by stacking the ceramic green sheets having the internal electrode patterns formed thereon and the ceramic green sheets having no internal electrode patterns formed thereon, and then firing the stacked ceramic green sheets; polishing edges of the ceramic body; and forming a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode, wherein in a length-thickness (L-T) cross-section of the ceramic body, in the case in which a square is defined as including sides parallel to a central portion of a first main surface of the ceramic body, and vertices disposed in a diagonal direction on outer surfaces of the ceramic body, the sides having a length of 30 .mu.m, when an area of a region of the square not occupied by the ceramic body is defined as A-out and a thickness of the cover layer is defined as t, the following Equations are satisfied: 10 .mu.m.sup.2.ltoreq.A-out and A-out/t.ltoreq.3.5 m.

"The ceramic body may have a thickness of 0.12 mm or less after firing.

"The cover layer may include upper and lower cover layers, and the thickness t of the cover layer may be an average of thicknesses of the upper and lower cover layers.

"According to another embodiment of the present invention, there is provided a polishing device including: a revolving table having a rotation axis in a direction perpendicular to a direction of gravity; a polishing tank disposed on a surface of the revolving table, having a rotation axis in the direction perpendicular to the direction of gravity, and including a 0603-sized ceramic body and a polishing element introduced therein; a polishing tank rotation controlling part controlling rotation of the polishing tank; and a revolving table rotation controlling part controlling rotation of the revolving table, wherein the rotation axes of the polishing tank and the revolving table are formed at different positions to be in parallel to each other.

"When the rotation of the polishing tank is defined as rotation and the rotation of the revolving table is defined as revolution, rotational speed/revolution speed may be a rational number rather than an integer.

"The 0603-sized ceramic body may include a dielectric layer and a cover layer and have a thickness of 0.12 mm or less after firing.

BRIEF DESCRIPTION OF THE DRAWINGS

"The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

"FIG. 1 is a perspective view showing a multilayer ceramic capacitor according to an embodiment of the present invention;

"FIG. 2 is a cross-sectional view taken along line X-X' of FIG. 1.

"FIG. 3 is a perspective view showing a ceramic body of the multilayer ceramic capacitor according to the embodiment of the present invention;

"FIG. 4 is a cross-sectional view taken along line X-X' of FIG. 3.

"FIG. 5 is a cross-sectional view showing a circuit board having a multilayer ceramic capacitor embedded therein according to an embodiment of the present invention;

"FIG. 6 is a perspective view showing a polishing device according to an embodiment of the present invention; and

"FIG. 7 is a view showing a manufacturing process of a multilayer ceramic capacitor according to an embodiment of the present invention."

For additional information on this patent application, see: OH, Deok Seok; CHAE, Eun Hyuk; JEON, Jung Hyun; JUNG, Jin Man. Multilayer Ceramic Capacitor, Manufacturing Method Therefor, Circuit Board Having Multilayer Ceramic Capacitor Embedded Therein, and Polishing Device for Multilayer Ceramic Capacitor. Filed June 26, 2013 and posted August 7, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=6308&p=127&f=G&l=50&d=PG01&S1=20140731.PD.&OS=PD/20140731&RS=PD/20140731

Keywords for this news article include: Patents, Electronics, Circuit Board.

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Source: Electronics Newsweekly


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