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Researchers Submit Patent Application, "Light Emitting Device, Light Emitting Device Package, and Lighting System", for Approval

August 20, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors BAE, Jung Hyeok (Seoul, KR); Jeong, Young Kyu (Seoul, KR); Park, Kyung Wook (Seoul, KR); Park, Duk Hyun (Seoul, KR), filed on March 31, 2014, was made available online on August 7, 2014.

The patent's assignee is LG Innotek Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "Embodiments relate to a light emitting device, a light emitting device package, and a lighting system.

"A light emitting diode (LED) is a semiconductor light emitting device converting current to light. In recent years, as the luminance of the LED increases gradually, the use of the LED as a light source for a display, a light source for a vehicle, and a light source for a lighting system is increasing. An LED emitting white light and having superior efficiency may be implemented by using a fluorescent material or combining individual LEDs that emit three primary colors.

"The luminance of the LED depends on various conditions, such as the structure of an active layer, a light extracting structure capable of effectively extracting light to an outside, semiconductor material used in the LED, a chip size, and the type of a molding member enclosing the LED."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "Embodiments provide a light emitting device, a light emitting device package, and a lighting system having novel structures.

"Embodiments also provide a light emitting device, a light emitting device package, and a lighting system having high heat-radiation efficiency.

"Embodiments also provide a light emitting device, a light emitting device package, and a lighting system having enhanced physical properties, such as strength and electrical conductivity.

"In one embodiment, a light emitting device includes: a light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a conductive support member under the light emitting structure. The conductive support member comprises a first conductive support member and a second conductive support member. The second conductive support member has a thermal conductivity higher than that of the first conductive support member.

"In another embodiment, a light emitting device package includes: a package body; a first and second electrode layers on the package body; and a light emitting device on the package body, the light emitting body electrically connected to the first and second electrode layers. The light emitting device includes: a light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a conductive support member under the light emitting structure. The conductive support member comprises a first conductive support member and a second conductive support member. The second conductive support member has a thermal conductivity higher than that of the first conductive support member.

"In a further embodiment, a lighting system comprising: a substrate; and a light emitting module including a light emitting device. The light emitting device includes: a light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a conductive support member under the light emitting structure. The conductive support member comprises a first conductive support member and a second conductive support member. The second conductive support member has a thermal conductivity higher than that of the first conductive support member.

BRIEF DESCRIPTION OF THE DRAWINGS

"FIG. 1 is a cross-sectional view of a light emitting device according to an embodiment.

"FIG. 2 is a cross-sectional view of a light emitting device according to a modified example.

"FIG. 3 is a cross-sectional view of a light emitting device according to another modified example.

"FIGS. 4 to 9 are cross-sectional views illustrating a method of manufacturing a light emitting device according to a first embodiment.

"FIGS. 10 and 11 are cross-sectional views illustrating a method of manufacturing a light emitting device according to a second embodiment.

"FIG. 12 is a cross-sectional view of a light emitting device package including a light emitting device according to embodiments.

"FIG. 13 is a disassembled perspective view of a backlight unit including a light emitting device or a light emitting device package according to an embodiment.

"FIG. 14 is a perspective view of a lighting unit including a light emitting device or a light emitting device package according to an embodiment."

For additional information on this patent application, see: BAE, Jung Hyeok; Jeong, Young Kyu; Park, Kyung Wook; Park, Duk Hyun. Light Emitting Device, Light Emitting Device Package, and Lighting System. Filed March 31, 2014 and posted August 7, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5707&p=115&f=G&l=50&d=PG01&S1=20140731.PD.&OS=PD/20140731&RS=PD/20140731

Keywords for this news article include: Electronics, Semiconductor, LG Innotek Co. Ltd..

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


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Source: Electronics Newsweekly


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