News Column

Researchers Submit Patent Application, "Image Sensor Module and Method of Manufacturing the Same", for Approval

August 19, 2014



By a News Reporter-Staff News Editor at China Weekly News -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors CHA, Ji Bum (Suwon, KR); LEE, Sung Jae (Suwon, KR); CHANG, In Cheol (Suwon, KR); BYUN, Sung Jun (Suwon, KR), filed on January 14, 2014, was made available online on August 7, 2014.

The patent's assignee is Samsung Electro-mechanics Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The present disclosure relates to an image sensor module capable of alleviating a warpage phenomenon in an image sensor, and a method of manufacturing the same.

"As a subminiature camera module such as a mobile communications terminal is improved in terms of the resolution thereof, an image sensor has a reduced pixel size. Here, a degree of warpage of the image sensor may significantly influence resolution.

"In addition, in accordance with demand for subminiature camera module miniaturization, a bare image sensor has recently been required to have a greatly reduced thickness. It may be seen that a warpage phenomenon is caused in the image sensor by curing of a bond during a process of attaching the image sensor having the reduced thickness to a substrate.

"In the case in which a warpage phenomenon is caused in the image sensor, optical performance of a lens may be deteriorated.

"Related Art Document

"(Patent Document 1) Japanese Patent Laid-Open Publication No. 2006-303481

"(Patent Document 2) Japanese Patent Laid-Open Publication No. 2006-303482"

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "An aspect of the present disclosure may provide an image sensor module in which a warpage phenomenon occurring when an image sensor having a reduced thickness is attached to a substrate is decreased, and a method of manufacturing the same.

"According to an aspect of the present disclosure, an image sensor module may include: an image sensor having a small thickness of 175 .mu.m or less and having a first coefficient of thermal expansion; a substrate having the image sensor mounted thereon and having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion; and an adhesive layer disposed between the image sensor and the substrate and including an adhesive having a third coefficient of thermal expansion of 130 ppm/.degree. C. or more at a glass transition temperature Tg or more.

"The adhesive may include a curable adhesive, and the glass transition temperature of the adhesive may be lower than a curing temperature of the adhesive.

"The adhesive may have a thickness less than that of the image sensor.

"The substrate may include a copper clad laminate (CCL).

"The adhesive may be an epoxy-based adhesive.

"According to an aspect of the present disclosure, a method of manufacturing an image sensor module may include: dispensing an adhesive having a third coefficient of thermal expansion of 130 ppm/.degree. C. or more at a glass transition temperature Tg or more to a substrate having a second coefficient of thermal expansion and a thickness of 175 .mu.m or less; temporarily curing and attaching an image sensor having a first coefficient of thermal expansion to the substrate to which the adhesive has been dispensed; and curing the adhesive at the glass transition temperature Tg or more of the adhesive.

"Pressure may be applied for 1 to 2 seconds at a temperature range of 120.degree. C. to 160.degree. C. in the attaching of the image sensor to the substrate.

"The curing of the adhesive may be performed for about 120 seconds at about 120.degree. C.

"The adhesive may be applied to form an adhesive layer thinner than the image sensor.

"The substrate may include a copper clad laminate (CCL) .

"The adhesive may be an epoxy-based adhesive.

BRIEF DESCRIPTION OF THE DRAWINGS

"The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

"FIG. 1 is a schematic view illustrating that an image is captured by an image sensor module according to an exemplary embodiment of the present disclosure;

"FIG. 2 is a schematic exploded perspective view illustrating an image sensor module according to an exemplary embodiment of the present disclosure;

"FIG. 3 is a schematic plan view of FIG. 2 illustrating a method of measuring a warpage deformation of an image sensor;

"FIG. 4A is a schematic side view of the image sensor module of FIG. 2;

"FIG. 4B is a schematic view illustrating a deformation amount .DELTA.z when the warpage deformation of the image sensor is generated in an optical axis;

"FIG. 5 is a schematic view illustrating sequential operations in a manufacturing process of an image sensor module according to an exemplary embodiment of the present disclosure;

"FIG. 6A illustrates a warpage deformation measurement value of an image sensor according to a comparative example measured by a contact type measuring device; and

"FIG. 6B illustrates a warpage deformation measurement value of an image sensor according to an exemplary embodiment of the present disclosure measured by the contact type measuring device."

For additional information on this patent application, see: CHA, Ji Bum; LEE, Sung Jae; CHANG, In Cheol; BYUN, Sung Jun. Image Sensor Module and Method of Manufacturing the Same. Filed January 14, 2014 and posted August 7, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5645&p=113&f=G&l=50&d=PG01&S1=20140731.PD.&OS=PD/20140731&RS=PD/20140731

Keywords for this news article include: Asia, Japan, Samsung Electro-mechanics Co. Ltd.

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Source: China Weekly News


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