News Column

Researchers Submit Patent Application, "Chip Package and Manufacturing Method Thereof", for Approval

August 20, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Chang, Yi-Chang (Hsin-Chu, TW); Chen, Yen-Hsin (Hsin-Chu, TW); Shen, Chi-Chih (Hsin-Chu, TW), filed on January 24, 2014, was made available online on August 7, 2014.

The patent's assignee is PixArt Imaging Incorporation.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a chip package and a manufacturing method thereof; particularly, it relates to such chip package with a function of heat sink and a manufacturing method thereof.

"FIG. 1 shows a schematic diagram of a prior art chip package 1 from cross-section view. As shown in FIG. 1, the chip package 1 for example is an image sensor chip package, which includes: a semiconductor chip 11, a bond pad 12, a chamber wall 13, an optical glass 14, an electrical conductive pad 15, an electrical conductive wire 16, a barrier solder mask 17, solder balls 18, and a solder mask face 19. An optical image signal passes through the optical glass 14 and a cavity formed by the chamber wall 13 to enter the semiconductor chip 11. The optical image signal is converted to an electronic signal by a circuit operating in the semiconductor chip 11, and the electronic signal is delivered from the bond pad 12, via the conductive pad 15, the conductive wire 16, and the solder balls 18, to a printed circuit board (PCB, not shown).

"When the circuit in the semiconductor substrate 11 operates, heat is generated. The chip package 1 for example is a chip scale package (CSP), and such heat dissipation issue will impact the performance of the semiconductor chip 11, generating noises in the optical image signal, and even damaging the chip package 1 in a severe situation.

"In view of above, to overcome the drawbacks in the prior art, the present invention proposes a chip package and a manufacturing thereof, which improves the heat dissipation efficiency of the chip package to reduce the operation temperature and improve the operating performance of the chip."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "From one perspective, the present invention provides a chip package, which includes: a semiconductor chip having an upper surface and a lower surface opposite to each other; a metal heat conductive layer formed on the lower surface, for conducting or absorbing heat generated by the semiconductor chip; and a bond pad formed on the upper surface, for electrically connecting with a circuit in the semiconductor chip.

"From another perspective, the present invention provides a manufacturing method of chip package, includes: providing a semiconductor chip having an upper surface and a lower surface opposite to each other; forming a metal heat conductive layer on the lower surface, for conducting or absorbing heat generated by the semiconductor chip; and forming a bond pad on the upper surface, for electrically connecting with a circuit in the semiconductor chip.

"In one preferable embodiment, the chip package further includes a metal heat conductive strip, which is connected to the metal heat conductive layer; and a solder ball or a lead, which is coupled to the metal heat conductive strip; whereby heat generated by a circuit of the semiconductor chip is conducted to the solder ball or the lead via the metal heat conductive layer and the metal heat conductive strip.

"In the aforementioned embodiment, the solder ball or the lead is preferably electrically connected to a ground level.

"In one preferable embodiment, the metal heat conductive layer entirely covers the lower surface.

"In one preferable embodiment, the circuit in the semiconductor chip includes an image sensor circuit.

"The objectives, technical details, features, and effects of the present invention will be better understood with regard to the detailed description of the embodiments below.

BRIEF DESCRIPTION OF THE DRAWINGS

"FIG. 1 shows a schematic diagram of a prior art chip package 1 from cross-section view.

"FIG. 2 shows a first embodiment of the present invention.

"FIG. 3 shows a second embodiment of the present invention.

"FIG. 4 shows a third embodiment of the present invention.

"FIGS. 5A-5E shows a fourth embodiment of the present invention.

"FIG. 6 shows a fifth embodiment of the present invention."

For additional information on this patent application, see: Chang, Yi-Chang; Chen, Yen-Hsin; Shen, Chi-Chih. Chip Package and Manufacturing Method Thereof. Filed January 24, 2014 and posted August 7, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5603&p=113&f=G&l=50&d=PG01&S1=20140731.PD.&OS=PD/20140731&RS=PD/20140731

Keywords for this news article include: Electronics, Semiconductor, PixArt Imaging Incorporation.

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Source: Electronics Newsweekly


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