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Researchers Submit Patent Application, "Alternating Current Light Emitting Diode Flip-Chip", for Approval

August 20, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventor TSO, Shih-Yang (Taipei City, TW), filed on January 29, 2014, was made available online on August 7, 2014.

The patent's assignee is Luxo-led Co., Limited.

News editors obtained the following quote from the background information supplied by the inventors: "The disclosure relates to an alternating current light emitting diode flip-chip.

"Light emitting devices (LEDs) are semiconductor devices that produce light when a current is supplied to them. LEDs are capable of emitting light in various colors through a light source by varying materials of a compound semiconductor, such as GaAs, AIGaAs, GaN, InGaInP, and the like. In general, the LED is manufactured in a package form.

"LEDs are intrinsically DC devices that only pass current in one polarity and historically have been driven by DC voltage sources using resistors, current regulators and voltage regulators to limit the voltage and current delivered to the LED. Some LEDs have resistors built into the LED package providing a higher voltage LED typically driven with 5V DC or 12V DC. With proper design considerations LEDs may be driven more efficiently with AC than with DC drive schemes.

"Recently, the LED package being developed and manufactured is in a flip chip structure. The flip chip LED package may be manufactured by forming a solder bump on an electrode pad provided in an LED, performing a reflow process, and flip-chip bonding the LED to a package substrate. However no AC LED is manufactured using the flip chip process. Thus there is a need to develop an AC LED package in a flip chip structure."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "The embodiment of the disclosure discloses an alternating current light emitting diode flip chip is provided. The flip chip includes an alternating current light emitting diode chip having a first bond pad and a second bond pad formed thereon. A first solder ball is disposed on the first bond pad and a second solder ball is disposed on the second bond pad. A flip-chip bonding process is performed to bond a carrier substrate with the first solder ball and the second solder ball.

"The detailed characteristics and advantages of the disclosure are described in the following embodiments in details, the techniques of the disclosure can be easily understood and embodied by a person of average skill in the art, and the related objects and advantages of the disclosure can be easily understood by a person of average skill in the art by referring to the contents, the claims and the accompanying drawings disclosed in the specifications.

BRIEF DESCRIPTION OF THE DRAWINGS

"The present disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus are not limitative of the present disclosure, and wherein:

"FIG. 1 illustrates an alternating current light emitting diode flip chip according to one embodiment of the disclosure."

For additional information on this patent application, see: TSO, Shih-Yang. Alternating Current Light Emitting Diode Flip-Chip. Filed January 29, 2014 and posted August 7, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5711&p=115&f=G&l=50&d=PG01&S1=20140731.PD.&OS=PD/20140731&RS=PD/20140731

Keywords for this news article include: Electronics, Semiconductor, Light-emitting Diode, Luxo-led Co. Limited.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


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Source: Electronics Newsweekly


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