News Column

Patent Issued for Electronic Component and Producing Method

August 19, 2014



By a News Reporter-Staff News Editor at China Weekly News -- Murata Manufacturing Co., Ltd. (Kyoto, JP) has been issued patent number 8797711, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventors are Matsumoto, Seiichi (Nagaokakyo, JP); Iwanaga, Toshiyuki (Sabae, JP); Ogawa, Makoto (Fukui, JP); Motoki, Akihiro (Fukui, JP).

This patent was filed on December 8, 2009 and was published online on August 5, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "The present invention relates to an electronic component and a producing method thereof, particularly to an electronic component in which an external electrode is formed by directly plating a particular region in a surface of a component body and a producing method thereof.

"For example, Japanese Patent Publication Laid-Open No. 63-169014 discloses a method for forming an external electrode of a laminated ceramic capacitor. More particularly, a component body included in the laminated ceramic capacitor is formed into a rectangular solid shape, the component body includes a pair of principal surfaces opposed to each other, a pair of side surfaces opposed to each other, and a pair of end surfaces opposed to each other, and end edges of internal electrodes are exposed onto the end surface. The external electrode is formed by electroless plating so as to short-circuit the end edges of the internal electrodes, which are exposed onto the end surface of the component body.

"Japanese Patent Publication Laid-Open No. 63-169014 discloses a structure in which the external electrode is formed only on the end surface of the component body. However, the laminated ceramic capacitor in which the external electrode is formed only on the end surface of the component body is inferior to other laminated ceramic capacitors in a surface mounting property. In order to improve the surface mounting property, it is necessary to extend the external electrode to not only the end surface of the component body but also a portion adjacent to the end surface, the portion being part of each of the principal surface and the side surfaces.

"When the external electrode is formed by directly plating the surface of the component body, a plating film can be grown on not only the end surface of the component body but also a portion adjacent to the end surface, the portion being part of each of a principal surface and a side surface, using a fast-growing plating solution and plating conditions. However, it is difficult to control end edges of turning portions in a desired position without generating variation at a growth point of the plating film, that is, in the principal surface and side surface of the component body.

"Although the external electrode is formed by electroless plating in the technique disclosed in Japanese Patent Publication Laid-Open No. 63-169014, the same holds true for electrolytic plating."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventors' summary information for this patent: "In view of the foregoing, preferred embodiments of the present invention provide an electronic component in which a position of the end edge of the plating film constituting the external electrode can be successfully controlled and a producing method thereof, in a case where the external electrode is formed by directly plating the surface of the component body.

"According to a preferred embodiment of the present invention, an electronic component includes a component body, and an external electrode that is disposed on a particular region in a surface of the component body, and in order to solve the above technical problems, the external electrode is formed by directly plating the surface of the component body, a bump is provided in a position where the particular region is partitioned in the surface of the component body, and an end edge of the external electrode is located in the bump.

"In a preferred embodiment of the present invention, the bump may be formed while a wall surface of the bump substantially perpendicularly rises from the particular region in the surface of the component body to a predetermined height, or may be formed while a wall surface of the bump substantially perpendicularly falls from the particular region in the surface of the component body to a predetermined depth.

"In the electronic component according to a preferred embodiment of the present invention, the component body is a substantially rectangular solid, the component body includes a pair of principal surfaces opposed to each other, a pair of side surfaces opposed to each other, and a pair of end surfaces opposed to each other, the external electrode is disposed on the pair of end surfaces and on a portion adjacent to the end surfaces, the portion being part of each of the principal surfaces and part of each of the side surfaces, and the bump is provided on the principal surface and the side surface so as to extend around the component body.

"In the above preferred embodiment, more preferably, the component body has a laminated structure including a plurality of electric insulation layers and an internal electrode, the electric insulation layers being laminated while extended in a direction of the principal surface, the internal electrode being arranged along a particular interface between the electric insulation layers, the end edge of the internal electrode is exposed onto at least one of the end surfaces of the component body, and the external electrode is arranged such that the exposed end edge of the internal electrode is covered therewith.

"Another preferred embodiment of the present invention is directed to a method for producing an electronic component, the electronic component including a component body and an external electrode formed on a particular region in a surface of the component body.

"The electronic component producing method according to a preferred embodiment of the present invention includes a step of preparing the component body in which a bump is provided in a position, the particular region where the external electrode should be formed being partitioned at the position, and a plating step of directly plating the surface of the component body to deposit a plating film in the particular region, the plating film constituting the external electrode. The plating step includes a step of growing the plating film toward the bump and a step of substantially stopping or delaying the growth of the plating film in the bump.

"In the electronic component producing method according to a preferred embodiment of the present invention, preferably, the component body is formed into a substantially rectangular solid, the component body includes a pair of principal surfaces opposed to each other, a pair of side surfaces opposed to each other, and a pair of end surfaces opposed to each other, the component body has a laminated structure including a plurality of electric insulation layers and an internal electrode, the electric insulation layers being laminated while extended in a direction of the principal surface, the internal electrode being formed along a particular interface between the electric insulation layers, the end edge of the internal electrode is exposed onto at least one of the end surfaces of the component body. The bump is provided on the principal surface and the side surface so as to extend around the component body. In the plating process, the plating film starts to deposit from the exposed end edge of the internal electrode while terminating the deposition in the bump, the exposed end edge of the internal electrode is covered with the plating film, and the plating film is formed on the pair of end surfaces and a portion adjacent to the end surfaces, the portion being part of each of the principal surfaces and part of each of the side surfaces.

"According to a preferred embodiment of the present invention, the growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump, so that the region where the plating film is formed can be controlled with good accuracy. When the electrolytic plating is adopted, it is not necessary to form an underlying conductive film for defining the region where the plating film is formed. When the electroless plating is adopted, it is not necessary to perform a catalytic treatment to the particular region. Therefore, cost reduction can be achieved in forming the external electrode.

"When the electronic component includes a component body having a rectangular solid shape while the external electrode is formed on the pair of end surfaces and a portion adjacent to each end surface, the portion being part of each of the principal surface and side surface, the dimensional accuracy is enhanced in the turning portion of the external electrode on a portion of each of the principal surface and side surface, so that a surface mounting process for the electronic component can be performed with high accuracy and efficiency.

"Other features, elements, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the present invention with reference to the attached drawings."

For the URL and additional information on this patent, see: Matsumoto, Seiichi; Iwanaga, Toshiyuki; Ogawa, Makoto; Motoki, Akihiro. Electronic Component and Producing Method. U.S. Patent Number 8797711, filed December 8, 2009, and published online on August 5, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8797711.PN.&OS=PN/8797711RS=PN/8797711

Keywords for this news article include: Asia, Japan, Murata Manufacturing Co. Ltd.

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Source: China Weekly News


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