News Column

Spansion Assigned Patent

August 12, 2014



By Targeted News Service

ALEXANDRIA, Va., Aug. 12 -- Spansion, Sunnyvale, California, has been assigned a patent (8,796,864) developed by two co-inventors for "[f]lip chip bonded semiconductor device with shelf." The co-inventors are Naomi Masuda, Kanagawa, Japan, and Koji Taya, Kanagawa, Japan.

The patent application was filed on June 14, 2013 (13/918,674). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8796864.PN.&OS=PN/8796864&RS=PN/8796864

Written by JudeBautista, edited by Vessie Ann Abalos.

30BautistaJude 140812-1046660


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Source: Targeted News Service


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