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Freescale Semiconductor Assigned Patent for Embedded Heat Spreading Semiconductor Device

August 11, 2014



By Targeted News Service

ALEXANDRIA, Va., Aug. 11 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,796,841) developed by three co-inventors for a "semiconductor device with embedded heat spreading." The co-inventors are Edward O. Travis, Austin, Texas, Douglas M. Reber, Austin, Texas, and Mehul D. Shroff, Austin, Texas.

The patent application was filed on April 9, 2012 (13/442,014). The full text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8796841.PN.&OS=PN/8796841&RS=PN/8796841

Written by Eloisa Asedillo; edited by Vessie Ann Abalos.

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Source: Targeted News Service


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