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Freescale Semiconductor Assigned Patent for Embedded Heat Spreading Semiconductor Device

August 11, 2014

By Targeted News Service

ALEXANDRIA, Va., Aug. 11 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,796,841) developed by three co-inventors for a "semiconductor device with embedded heat spreading." The co-inventors are Edward O. Travis, Austin, Texas, Douglas M. Reber, Austin, Texas, and Mehul D. Shroff, Austin, Texas.

The patent application was filed on April 9, 2012 (13/442,014). The full text of the patent can be found at

Written by Eloisa Asedillo; edited by Vessie Ann Abalos.


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Source: Targeted News Service

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