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Researchers Submit Patent Application, "Semiconductor Packages Including Semiconductor Chips Having Protrusions and Methods of Fabricating the Same",...

July 16, 2014



Researchers Submit Patent Application, "Semiconductor Packages Including Semiconductor Chips Having Protrusions and Methods of Fabricating the Same", for Approval

By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors KIM, Ji Eun (Suwon-si Gyeonggi-do, KR); JOH, Cheol Ho (Icheon-si Gyeonggi-do, KR); SHIN, Hee Min (Seongnam-si Gyeonggi-do, KR); LEE, Kyu Won (Seoul, KR); CHO, Chong Ho (Incheon, KR), filed on March 18, 2013, was made available online on July 3, 2014.

The patent's assignee is Sk Hynix Inc.

News editors obtained the following quote from the background information supplied by the inventors: "Embodiments of the present disclosure generally relate to semiconductor packages and methods of fabricating the same and, more particularly, to semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same.

"Recently, smaller, thinner and higher performance semiconductor packages are more increasingly in demand. In response to such a demand, chip-scaled package techniques and stack package techniques have been continuously developed.

"Semiconductor stack packages have been proposed to improve a packing density thereof. In general, the semiconductor stack packages may be fabricated by stacking a plurality of semiconductor chips on a substrate and electrically connecting the plurality of semiconductor chips to the substrate with a wire bonding technique. Even in fabrication of the semiconductor stack packages, attempts to reduce the thickness and size of the semiconductor stack packages have been still continuously made. For example, many efforts to reduce the thickness of the semiconductor chips have been continuously made. In addition, attempts to prevent the degradation of electrical and physical reliability of the semiconductor packages have been made with the development of thinner semiconductor chips."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "Various embodiments are directed to semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same.

"According to some embodiments, a semiconductor package may include an upper semiconductor chip stacked on a package substrate and a support layer or a lower semiconductor chip disposed between the upper semiconductor chip and the package substrate. The upper semiconductor chip may include a protrusion downwardly extending from an edge thereof. The protrusion of the upper semiconductor chip may be combined with a sidewall of the support layer or the lower semiconductor chip.

"According to further embodiments, a semiconductor package may include a package substrate, a first stack structure including a plurality of semiconductor chips vertically stacked on the package substrate and laterally shifted in a first direction; and a second stack structure including a plurality of semiconductor chips vertically stacked on the first stack structure and laterally shifted in an opposite to the first direction. Each of the semiconductor chips of the first and second stack structures may include a protrusion downwardly extending from an edge thereof. The protrusion of one of the semiconductor chips is combined with a sidewall of the underlying semiconductor chip or a support layer disposed thereunder.

"According to further embodiments, a method of fabricating a semiconductor package may include forming a plurality of semiconductor chips on a first surface of a wafer, applying a patterning process to a second surface of the wafer opposite to the first surface to form step patterns, and slicing the wafer to separate the semiconductor chips from each other. Each of the separated semiconductor chips includes a protrusion defined by the step pattern to vertically extend from an edge thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

"Embodiments of the inventive concept will become more apparent in view of the attached drawings and accompanying detailed description, in which:

"FIG. 1A is a schematic cross sectional view illustrating a semiconductor package according to an embodiment;

"FIG. 1B is a perspective view illustrating one of semiconductor chips in the semiconductor package of FIG. 1;

"FIGS. 2A and 2B are perspective views illustrating semiconductor chips stacked in semiconductor packages according to some embodiments;

"FIG. 3 is a schematic cross sectional view illustrating a semiconductor package according to another embodiment;

"FIG. 4 is a schematic cross sectional view illustrating a semiconductor package according to yet another embodiment;

"FIG. 5 is a schematic cross sectional view illustrating a semiconductor package according to still another embodiment;

"FIGS. 6A and 6B are cross sectional views illustrating a comparative example of a semiconductor package and a semiconductor package according to an embodiment, respectively;

"FIG. 7 is a schematic cross sectional view illustrating a semiconductor package according to yet still another embodiment;

"FIG. 8 is a flow chart illustrating a method of fabricating a semiconductor package according to an embodiment; and

"FIGS. 9 to 14 are cross sectional views illustrating a method of fabricating a semiconductor package according to an embodiment."

For additional information on this patent application, see: KIM, Ji Eun; JOH, Cheol Ho; SHIN, Hee Min; LEE, Kyu Won; CHO, Chong Ho. Semiconductor Packages Including Semiconductor Chips Having Protrusions and Methods of Fabricating the Same. Filed March 18, 2013 and posted July 3, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=6399&p=128&f=G&l=50&d=PG01&S1=20140626.PD.&OS=PD/20140626&RS=PD/20140626

Keywords for this news article include: Electronics, Sk Hynix Inc, Semiconductor.

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Source: Electronics Newsweekly


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