News Column

Researchers Submit Patent Application, "Core Substrate and Method for Manufacturing the Same, and Substrate with Built-In Electronic Components and...

July 16, 2014



Researchers Submit Patent Application, "Core Substrate and Method for Manufacturing the Same, and Substrate with Built-In Electronic Components and Method for Manufacturing the Same", for Approval

By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Lee, Seung Eun (Sungnam, KR); SHIN, Yee Na (Suwon, KR); CHUNG, Yul Kyo (Yongin, KR); LEE, Doo Hwan (Daejeon, KR), filed on December 12, 2013, was made available online on July 3, 2014.

The patent's assignee is Samsung Electro-mechanics Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a core substrate, a manufacturing method thereof, and a substrate with built-in electronic components and a method for manufacturing the same.

"In order to minimize the warpage during the manufacturing a conventional package substrate, a core material with a low CTE (Coefficient of Thermal Expansion) and a build-up material have been used. In case of the embedded substrate, a cavity is fabricated on the core substrate; an electronic component is incorporated therein. At this time, if the overall thickness of the substrate is uniform, since the warpage of the whole substrate becomes to be reduced as the thickness of the core with a lower CTE becomes thicker, the thick core is used. Accordingly, the volume of the cavity gap of the core incorporated therein the electronic component increases; it is possible to generate a void failure not to sufficiently fill the cavity gap in the build-up material. And also, in order to reduce the warpage, the build-up material adopts a material with a low CTE, since the amount of resin is relatively small in case of the material with the low CTE; the danger to generate failure not to fill the cavity gap becomes larger."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "It is, therefore, an object of the present invention to provide a core substrate to be utilized for manufacturing a substrate with built-in electronic components and a substrate with built-in electronic components improved in mechanical characteristics and reliability.

"Another object of the present invention is to provide methods for manufacturing the core substrate and the substrate with built-in electronic components improved in mechanical characteristics and reliability.

"In order to overcome the above-described problems, in accordance with a first embodiment of the present invention, there is provided a core substrate including: a first insulating layer; and a second insulating layer stacked on upper and lower surfaces of the first insulating layer and made of a material with a glass transition temperature lower than that of the first insulating layer.

"At this time, in an example, the core substrate further includes a metal layer stacked on upper and lower surfaces of the second insulating layer.

"And also, in another example, the first insulating layer includes a thermoplastic resin.

"And, in an example, the first insulating layer is a semi-hardening insulating layer and the second insulating layer is a hardening insulating layer.

"Thereafter, in order to overcome the above-described problems, in accordance with the second embodiment of the present invention, there is provided a substrate with built-in electronic components including: a core substrate provided with a cavity and including a first insulating layer and a second insulating layer stacked on upper and lower surfaces of the first insulating layer, wherein the second insulating layer is made of a material with a glass transition temperature lower than that of the first insulating layer; and electronic component fixed by an insulating material flown from the first insulating layer by being inserted into the cavity.

"At this time, in an example, the substrate with built-in electronic components further including a circuit pattern layer formed on upper and lower surfaces of the second insulating layer of the core substrate.

"And also, in an example, the first insulating layer includes a thermoplastic resin.

"And also, in an example, the substrate with built-in electronic components further includes a third insulating layer for covering the circuit pattern layer by being stacked on the second insulating layer.

"At this time, a gap is formed between a sidewall of the cavity and the electronic component and the gap is filled with the third insulating layer together with the first insulating layer.

"In addition, in order to overcome the above-described problems, in accordance with the third embodiment, there is provided a method for manufacturing a substrate with built-in electronic components including: preparing a core substrate provided with a cavity and including a first insulating layer and a second insulating layer stacked on upper and lower surfaces of the first insulating layer, wherein the second insulating layer is made of a material with a glass transition temperature lower than that of the first insulating layer; inserting the electronic component into the cavity; and fixing the electronic component by flowing an insulating material of the first insulating layer into a gap between the cavity and the electronic component by thermal compressing the core substrate inserted therein the electronic component.

"At this time, in an example, the core substrate further includes a metal layer formed on the second insulating layer, and further includes forming a circuit pattern by fabricating the metal layer.

"And also, at this time, the method for manufacturing a substrate with built-in electronic components further includes forming a third insulating layer to cover the second insulating layer and the circuit pattern.

"At this time, the gap is filled with the third insulating layer together with the first insulating layer.

"And also, in an example, preparing the core substrate includes: stacking the second insulating layer on the upper and the lower surfaces of the first insulating layer; and compressing the second insulating layer and the first insulating layer under a temperature lower than the glass transition temperature of the first insulating layer and higher than the glass transition temperature of the second insulating layer.

"And also, in an example, thermal compressing the core substrate is performed at a temperature higher than the glass transition temperature of the first insulating layer.

BRIEF DESCRIPTION OF THE DRAWINGS

"These and/or other aspects and advantages of the present general inventive concept will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

"FIG. 1 is a view schematically showing a core substrate in accordance with an embodiment of the present invention;

"FIGS. 2A and 2B are views schematically showing a core substrate in accordance with another embodiment of the present invention;

"FIGS. 3A to 3D are views schematically showing each step of a method for manufacturing a core substrate in accordance with another embodiment of the present invention;

"FIGS. 4A and 4B are views schematically showing a substrate with built-in electronic components in accordance with another embodiment of the present invention; and

"FIGS. 5A to 5E are views schematically showing each step of a method for a substrate with built-in electronic components in accordance with still another embodiment of the present invention."

For additional information on this patent application, see: Lee, Seung Eun; SHIN, Yee Na; CHUNG, Yul Kyo; LEE, Doo Hwan. Core Substrate and Method for Manufacturing the Same, and Substrate with Built-In Electronic Components and Method for Manufacturing the Same. Filed December 12, 2013 and posted July 3, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4845&p=97&f=G&l=50&d=PG01&S1=20140626.PD.&OS=PD/20140626&RS=PD/20140626

Keywords for this news article include: Electronic Components, Samsung Electro-mechanics Co. Ltd.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Electronics Newsweekly


Story Tools






HispanicBusiness.com Facebook Linkedin Twitter RSS Feed Email Alerts & Newsletters