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Patent Issued for Printed Circuit Board and Semiconductor Package Using the Same

July 16, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- A patent by the inventors Yuan, Qiu (Suzhou, CN); Maohua, Du (Suzhou, CN); Yucai, Huang (Suzhou, CN); Liqun, Gu (Suzhou, CN), filed on January 13, 2012, was published online on July 1, 2014, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.

Patent number 8766100 is assigned to Samsung Electronics Co., Ltd. (Suwon-Si, Gyeonggi-Do, KR).

The following quote was obtained by the news editors from the background information supplied by the inventors: "The inventive concept relates to semiconductor technology, and more particularly, to a printed circuit board and a semiconductor package using the same.

"As semiconductor devices are more highly integrated, there are more requirements for printed circuit boards (PCBs) in the semiconductor devices. Semiconductor chips are fixed to PCBs including metal wiring layers, overcoat layers and solder bumps on a substrate. A semiconductor chip is fixed to a printed circuit board by using an adhesive layer, which is bonded to the solder bumps. Conventional ways of fixing chips to PCBs have resulted in a complex PCB structure and low shear strength of a semiconductor chip. Accordingly, a less complex PCB structure for stably fixing the semiconductor chip, which also results in increased shear strength of the semiconductor chip, is required."

In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "According to an embodiment of the inventive concept, there is provided a semiconductor package including a printed circuit board, and a semiconductor chip mounted on the printed circuit board, wherein the printed circuit board includes a base substrate that includes a first surface and a second surface which are positioned opposite to each other, and includes through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by the adhesive layer and includes exposed portions exposed through the through-holes, an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface, and electrical connection members that electrically connect the wiring layer with the semiconductor chip.

"In some embodiments of the inventive concept, the semiconductor package may further include pads that are disposed on the exposed portions of the wiring layer and are electrically connected to the electrical connection members.

"In some embodiments of the inventive concept, the electrical connection members may be bonding wires that electrically connect the semiconductor chip with the pads. The electrical connection members may be plugs that are disposed on the pads and that fill in the through-holes. The pads may be plugs that fill in the through-holes. The electrical connection members may be solder balls that electrically connect the pads and the semiconductor chip.

"In some embodiments of the inventive concept, the concave-convex portion may have a regular shape or an irregular shape. The concave-convex portion may have at least one of a triangular shape, a semicircular shape, a zigzag shape, a square wave shape, and a sine wave shape. The concave-convex portion may have a linear shape that extends in a direction. The concave-convex portion may have a mesh shape. The concave-convex portion may have an isolated island shape.

"In some embodiments of the inventive concept, the adhesive member may cover at least a part of a side surface and a lower surface of the semiconductor chip.

"In some embodiments of the inventive concept, the semiconductor package may further include a protective layer that covers the semiconductor chip and the electrical connection members.

"In some embodiments of the inventive concept, the printed circuit board may be a flexible printed circuit board.

"According to another embodiment of the inventive concept, there is provided a printed circuit board including a base substrate that includes a first surface and a second surface which are positioned opposite to each other, and includes through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by using the adhesive layer and includes exposed portions exposed through the through-holes, and pads that are disposed on the exposed portions of the wiring layer.

"A method of manufacturing a semiconductor package, in accordance with an embodiment of the inventive concept, comprises forming a concave-convex portion on a first surface of the base substrate, forming an adhesive layer on a second surface of the base substrate opposite to the first surface, forming through-holes through the base substrate and the adhesive layer, forming a wiring layer on the adhesive layer, the wiring layer having exposed portions exposed through the through-holes, and mounting a semiconductor chip on the concave-convex portion by using an adhesive member, wherein the adhesive member fills in concave regions of the concave-convex portion.

"The method may further comprise flowing the adhesive member along the concave-convex portion to fill in the concave regions."

URL and more information on this patent, see: Yuan, Qiu; Maohua, Du; Yucai, Huang; Liqun, Gu. Printed Circuit Board and Semiconductor Package Using the Same. U.S. Patent Number 8766100, filed January 13, 2012, and published online on July 1, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8766100.PN.&OS=PN/8766100RS=PN/8766100

Keywords for this news article include: Circuit Board, Semiconductor, Samsung Electronics Co. Ltd..

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Source: Electronics Newsweekly


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