Patent number 8766304 is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "The invention relates in general to an element packaging structure, and more particularly to a package structure of semiconductor light emitting element.
"The light emitting diode (LED) emits a light by converting electricity into photo energy. The light emitting diode is mainly formed by a semiconductor. The light emitting diode, having the features of long lifespan, low temperature and high utilization rate of energy, has been widely used in various lamps and has gradually replaced conventional light sources.
"Conventional surface mount technology (SMT) light emitting diode is electrically connected to an external wire substrate through at least a metal wire, such that the semiconductor layer inside the light emitting diode is electrified by the current transmitted through the metal wire to illuminate. The metal wire is commonly formed by gold which has high ductility. The metal wire is not permeable to the light and is very expensive. Considering the cost and optical transmittance, the diameter of the metal wire cannot be too large otherwise the overall light output might be affected. Also, if the differences between the coefficient of thermal expansion (CTE) of the metal wire and those of the light emitting diode and the substrate are too large, the metal wire soldered between the light emitting diode and the substrate by a wire-bonding machine may be pulled and break or the solder ball at the end of the metal wire may come off. Particularly, during the temperature cycling test, the thermal stress may affect the structural strength of the metal wire and may even cause the metal wire to break or come off and end up with an increase in product failure rate."
In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventor's summary information for this patent: "The invention is directed to a package structure of semiconductor light emitting element, which enhances structural strength and increases optical transmittance through an electrical bonding structure provided by a transparent conductive board.
"According to an embodiment of the present invention, a package structure of semiconductor light emitting element is provided. The package structure of semiconductor light emitting element includes a substrate, a light emitting element and a transparent conductive board. A first electrode and a second electrode are disposed on the substrate. The light emitting element is disposed on the substrate and between the first electrode and the second electrode. A first bonding pad and a second bonding pad are disposed on the light emitting element. The transparent conductive board has a first surface and a second surface opposite to the first surface. The second surface of the transparent conductive board is located over the light emitting element for electrically connecting the first electrode and the first bonding pad and electrically connecting the second electrode and the second bonding pad.
"The above and other aspects of the invention will become better understood with regard to the following detailed description of the preferred but non-limiting embodiment(s). The following description is made with reference to the accompanying drawings."
URL and more information on this patent, see: Wang, Chi-Kuon. Package Structure of Semiconductor Light Emitting Element. U.S. Patent Number 8766304, filed
Keywords for this news article include: Semiconductor, Light-emitting Diode,
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