News Column

Patent Issued for Inverter Stack

July 16, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Kim, Jungbum (Seoul, KR); Yim, Namsik (Seoul, KR); Song, Hyeokjin (Seoul, KR); Lee, Beomseok (Seoul, KR); Ryu, Seunghee (Seoul, KR); Lee, Dongcheol (Seoul, KR), filed on September 6, 2011, was published online on July 1, 2014.

The patent's assignee for patent number 8767401 is LG Electronics Inc. (Seoul, KR).

News editors obtained the following quote from the background information supplied by the inventors: "The present disclosure relates to an inverter stack, and more particularly, to an inverter stack for suppressing an adverse effect on due to high temperature by improving its cooling performance.

"As is generally known, an inverter or inverter stack is an apparatus for converting direct-current power to high-frequency alternate-current power.

"Such an inverter stack is widely used in driving a high-frequency induction heater or three-phase AC motor for heating metal or the like using high-frequency power.

"The inverter stack may include an enclosure forming an accommodation space therein, and a circuit unit (inverter) having a switching element disposed at an inner portion of the enclosure to switch direct-current power to output high-frequency power, and a cooling unit dissipating heat generated by the circuit unit for cooling.

"However, in the inverter stack in the related art, a circuit unit is provided without taking sufficient consideration on the heating relations of components, thereby accelerating the enforced deterioration of peripheral components due to heat generated by high heat dissipation components. In particular, for other components disposed adjacent to high-temperature heat dissipation components, it may cause life reduction and/or performance degradation due to high heat directly transferred from the high heat dissipation components.

"Furthermore, when high heat dissipation components are disposed far apart from an outlet port without taking sufficient consideration on the heating relations of components, the dissipation of heat generated from the high heat dissipation components is delayed, thereby increasing an internal temperature of the enclosure.

"Taking such points into consideration, when the capacity of a cooling apparatus is increased, it may increase the consumption power of the cooling apparatus, thereby increasing the size of an overall device as well as raising the production cost."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "In order to solve the foregoing problem, one aspect of the detailed description is to provide an inverter stack capable of suppressing the damage of components due to high temperature.

"Furthermore, another aspect of the present disclosure is to provide an inverter stack capable of shortening the path of heat dissipation to suppress temperature increase.

"In addition, still another aspect of the present disclosure is to provide an inverter stack capable of reducing the capacity of a cooling apparatus to decrease the overall size of a device as well as reduce the production cost.

"In order to accomplish the foregoing objectives of the present invention, there is provided an inverter stack including an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space; a heat sink having a switching element, disposed within an upper region of the internal space; and a plurality of DC-link capacitors disposed within the internal space and below the heat sink.

"Here, the heat sink may partition the internal space of the enclosure to form an air passage through which the air drawn in from the inlet port flows to the outlet port.

"The inverter stack may further include a bus plate disposed at a side of the DC-link capacitors to extend the partition of the internal space of the enclosure to extend the air passage in cooperation with the heat sink.

"The inverter stack may further include a reactor disposed above the DC-link capacitors within the air passage.

"The heat sink may include a heat-dissipating plate and a plurality of heat-dissipating fins protruded from one side surface of the heat-dissipating plate and separately disposed in parallel to one another, and the heat-dissipating plate may partition the internal space of the enclosure in a frontward and rearward direction to form the air passage.

"The heat-dissipating fins may be disposed within the air passage, and the switching element may be provided at the other side surface of the heat-dissipating plate.

"The inverter stack may further include a cooling fan configured to draw in air from the inlet port and discharge the air from the outlet port.

"The cooling fan may be disposed at the outlet port.

"The DC-link capacitors may be vertically disposed in a row.

"On the other hand, according to another field of the present invention, there may be provided an inverter stack including an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space; a heat sink having a switching element, the heat sink oriented to partition the internal space of the enclosure to form an air passage within the enclosure; a plurality of DC-link capacitors disposed within the internal space and below the heat sink; a bus plate disposed below the heat sink to extend the air passage in cooperation with the heat sink; and a cooling fan disposed at the outlet port.

"Here, the switching element may include an insulated gate bipolar transistor.

"The heat sink may include a heat-dissipating plate and a plurality of heat-dissipating fins protruded from the heat-dissipating plate, and the bus plate may be disposed to be extended downward at a lower side of the heat sink.

"The heat-dissipating plate and heat-dissipating fins can be separated from and assembled with one another.

"The inverter stack may further include a reactor disposed above the DC-link capacitors within the air passage.

"The DC-link capacitors may be vertically disposed in a row.

"On the other hand, according to still another field of the present invention, there may be provided an inverter stack including an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space; a heat sink having a switching element, the heat sink oriented to partition the internal space of the enclosure to form an air passage within the enclosure; a bus plate disposed below the heat sink to extend the air passage in cooperation with the heat sink; a reactor disposed above the bus plate within the air passage; and a plurality of DC-link capacitors disposed below the heat sink and the reactor within the air passage.

"The heat sink includes a heat-dissipating plate and a plurality of heat-dissipating fins protruded from one side surface of the heat-dissipating plate, and the heat-dissipating plate may be extended downward from an upper plate of the enclosure to partition the internal space of the enclosure in a frontward and rearward direction.

"The bus plate may be disposed below the heat-dissipating plate, and a lower end of the bus plate may contact a bottom plate of the enclosure.

"A cooling fan may provided at the outlet port.

"The DC-link capacitors may be vertically disposed in a row."

For additional information on this patent, see: Kim, Jungbum; Yim, Namsik; Song, Hyeokjin; Lee, Beomseok; Ryu, Seunghee; Lee, Dongcheol. Inverter Stack. U.S. Patent Number 8767401, filed September 6, 2011, and published online on July 1, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8767401.PN.&OS=PN/8767401RS=PN/8767401

Keywords for this news article include: LG Electronics Inc.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Electronics Newsweekly


Story Tools






HispanicBusiness.com Facebook Linkedin Twitter RSS Feed Email Alerts & Newsletters