News Column

Nordson MARCH Posts White Paper Online

July 10, 2014

Nordson MARCH reported that the white paper, Plasma Clean to Reduce Wire Bond Failures, is now available on the Nordson MARCH website at bit.ly/PlasmaWP.

According to a company release, the article discusses the two areas of wire bonding: the wire bonding process itself (wire bond "statistics) and the long-term reliability of the device.

"In an ideal world we would be bonding onto clean metal surfaces on both the semiconductor device and the substrate or leadframe we are connecting it to," explained John Maguire, business manager, Nordson MARCH and author of the white paper. "In practice, there are a number of sources of surface contamination which influence the wire bond statistics and the device reliability. These contaminants cover the surface we want to bond to, preventing us from making a good bond. A bonding process can run for hours or days without encountering any issues and suddenly go out of control for no apparent reason. Decreases in bonded area, average shear strength, and pull strength are all indicators that when the bond is made, the area of contact between the bond wire and the pad will be sub- optimal. This is due to the surface contaminant impeding the process of "welding". Surface contamination will lead to a bond which does not reach its maximum potential strength."

Nordson MARCH is a provider of plasma processing technology.

More information and complete details:

www.nordsonmarch.com

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Source: Professional Services Close - Up


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