MIRTEC MV-9 SiP (Photo: Business Wire)
Industry demands for higher levels of semiconductor integration and lower costs continue to drive the popularity of System in Package (SiP) solutions. System in Package devices are characterized by any combination of one or more Integrated Circuits of different functionalities, which may include passive components and MEMS assembled into a single package that performs as a system or sub-system. SiP devices may contain wire bonded ICs, flip chips, and a host of discrete components that are traditionally found on system motherboards. MIRTEC’s MV-9 SIP System was designed to specifically address the precision inspection requirements associated with these advanced semiconductor solutions. The MV-9 SIP System is configured with MIRTEC’s award-winning OMNI-VISION® 2D/3D Inspection Technology which combines an exclusive 25MP CoaXPress 2D ISIS Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Quad MoirÉ 3D system to provide precision inspection of semiconductor assemblies. The MV-9 SIP system also features four (4) 10 Mega Pixel Side-View Cameras in addition to the 25 Mega Pixel Top-Down Camera.
As Ball Grid Array (BGA) manufacturing grows in popularity, replacing many gull wing fine-pitch packaged components, there is an increasing demand for inspection equipment which can verify the integrity of BGA device packages post of their fabrication. MIRTEC’s MP-7 MICRO is a highly specialized system designed specifically for precision BGA ball inspection. The MP-7 MICRO is configured with MIRTEC’s exclusive 15 Mega Pixel ISIS Vision System, a Precision 6 Micron Telecentric Compound Lens, and color strobe LED lighting.
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