News Column

Patent Issued for Wiring Board with Built-In Electronic Component and Method for Manufacturing the Same

August 6, 2014



By a News Reporter-Staff News Editor at Journal of Engineering -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Shimizu, Keisuke (Ogaki, JP); Mikado, Yukinobu (Ogaki, JP), filed on October 14, 2011, was published online on July 22, 2014.

The patent's assignee for patent number 8785788 is Ibiden Co., Ltd. (Ogaki-shi, JP).

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a wiring board with a built-in electronic component and its manufacturing method.

"Japanese Laid-Open Patent Publication No. 2002-204045 describes a method for manufacturing a wiring board with a built-in electronic component, including the following: forming an opening portion (cavity) in a core substrate; accommodating a capacitor in the opening portion; filling resin in a clearance between the core substrate and the capacitor in the opening portion; forming an insulation layer on both sides of the core substrate; and forming in each insulation layer a via conductor connected to an electrode of the capacitor. The publication also describes a wiring board with a built-in electronic component manufactured by such a method. The contents of Japanese Laid-Open Patent Publication No. 2002-204045 are incorporated herein by reference in their entirety in the present application."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "According to one aspect of the present invention, a wiring board with a built-in electronic component includes a substrate having an opening portion and having a first surface and a second surface on the opposite side of the first surface, and an electronic component having a third surface and a fourth surface on the opposite side of the third surface and positioned in the opening portion of the substrate such that the third surface faces the same direction as the first surface of the substrate. The electronic component has a curved surface joining the fourth surface and a side surface of the electronic component, and the opening portion of the substrate has a tapered portion formed by a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface.

"According to another aspect of the present invention, a method for manufacturing a wiring board with a built-in electronic component has preparing a substrate having a first surface and a second surface on the opposite side of the first surface, preparing an electronic component having a third surface and a fourth surface on the opposite side of the third surface, the electronic component including a curved surface joining the fourth surface and a side surface of the electronic component, forming in the substrate an opening portion which accommodates the electronic component, forming in the opening portion of the substrate a tapered portion by forming a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface, and positioning the electronic component in the opening portion such that the third surface of the electronic component faces in the same direction as the first surface of the substrate."

For additional information on this patent, see: Shimizu, Keisuke; Mikado, Yukinobu. Wiring Board with Built-In Electronic Component and Method for Manufacturing the Same. U.S. Patent Number 8785788, filed October 14, 2011, and published online on July 22, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8785788.PN.&OS=PN/8785788RS=PN/8785788

Keywords for this news article include: Ibiden Co. Ltd.

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Source: Journal of Engineering


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