News Column

Researchers Submit Patent Application, "Sealing Member, Sealing Method, and Method for Producing Optical Semiconductor Device", for Approval

August 6, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors OOYABU, Yasunari (Osaka, JP); ITO, Hisataka (Osaka, JP); SHINBORI, Yuki (Osaka, JP); SATO, Satoshi (Osaka, JP), filed on March 14, 2014, was made available online on July 24, 2014.

The patent's assignee is Nitto Denko Corporation.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a sealing member, in particular, to a sealing member that seals in an optical semiconductor element, a sealing method using such a sealing member, and a method for producing an optical semiconductor device including the sealing method.

"It has been known so far that an optical semiconductor element such as a light-emitting diode (LED) is sealed in with resin.

"For example, Japanese Unexamined Patent Publication No. 2002-43345 has proposed a method for sealing in a molding object with a resin: in this method, a molding object on which a semiconductor chip and circuit components are mounted, and a metal mold for molding a sealing resin that seals in the molding object are disposed to face each other; a sealing resin is injected in the metal mold with the molding face of the metal mold covered with a releasing film; and the molding object and the sealing resin are pressed against each other.

"In this method, the sealing in with resin is performed while the molding face of the metal mold is covered with a releasing film, and therefore the sealing resin is easily released from the metal mold, and at the same time, the sealing resin can be prevented from remaining in the metal mold."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "However, in the above-described method of Japanese Unexamined Patent Publication No. 2002-43345, every time the molding object is sealed in, the releasing film is sent out, and thereafter, the sealing resin is injected in the metal mold.

"Therefore, a time period for re-injecting the sealing resin in the metal mold is necessary during the period after the current sealing operation and before the next sealing operation, and working efficiency may be reduced.

"Thus, an object of the present invention is to provide a sealing member that is capable of sealing in a sealing object efficiently and continuously; a sealing method using the sealing member; and a method for producing an optical semiconductor device including the sealing method.

"A sealing member of the present invention includes an elongated releasing film, and a plurality of sealing resin layers composed of a sealing resin, the plurality of sealing resin layers being laminated on the releasing film so that the plurality of sealing resin layers are arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween.

"It is preferable that the sealing member of the present invention seals in an optical semiconductor element.

"It is preferable that the sealing member of the present invention further includes a lens-forming resin layer composed of a lens-forming resin that forms a lens, and interposed between the releasing film and the sealing resin layer.

"It is preferable that in the sealing member of the present invention, the sealing resin is a thermosetting resin, and the sealing resin layer is formed from the thermosetting resin in a B-stage state.

"A sealing method of the present invention includes a repetition of the steps of: allowing the sealing resin layer and a sealing object to face each other while conveying the above-described sealing member in a longitudinal direction; and pressing the sealing resin layer and/or the sealing object that are facing each other in a direction such that the sealing resin layer and the sealing object are brought closer, so as to seal in the sealing object with the sealing resin layer.

"In a method for producing an optical semiconductor device of the present invention, the sealing object is an optical semiconductor element, and the above-described sealing method is included.

"In the sealing method of the present invention, using a sealing member including an elongated releasing film, and a plurality of sealing resin layers laminated on the releasing film so as to be arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween, the following is repeated: the sealing resin layer and a sealing object are allowed to face each other while the sealing member is conveyed in the longitudinal direction, and the sealing resin layer and/or the sealing object that are facing each other are pressed in a direction such that the sealing resin layer and the sealing object are brought closer, so as to seal in the sealing object with the sealing resin layer.

"Therefore, the sealing object can be sealed in continuously by conveying the sealing member along the longitudinal direction, and successively sending out the sealing resin layers together with the releasing film.

"Thus, when the sealing object is to be sealed, the releasing film and the sealing resin layer can be set simultaneously every time, and therefore the time for resetting the sealing resin layer can be shortened.

"As a result, the sealing object can be sealed in efficiently and continuously, and when the sealing object is an optical semiconductor element, an optical semiconductor device can be produced efficiently.

BRIEF DESCRIPTION OF THE DRAWINGS

"FIG. 1 is a cross section of a sealing member in an embodiment of the present invention.

"FIG. 2 is a process diagram for describing a method for producing the sealing member shown in FIG. 1,

"(a) illustrating a step of forming a sealing resin layer on a base film, and

"(b) illustrating a step of forming a lens-forming resin layer on a releasing film.

"FIG. 3 is, following FIG. 2, a process diagram for describing a method for producing a sealing member,

" illustrating a step of laminating a sealing resin layer and a lens-forming resin layer,

"(d) illustrating a step of forming a cut having a predetermined shape in the base film, the sealing resin layer, and the lens-forming resin layer,

"(e) illustrating a step of removing a portion excluding the cut having the predetermined shape of the base film, the sealing resin layer, and the lens-forming resin layer, and

"(f) a step of removing the base film.

"FIG. 4 is a diagram for describing an embodiment of a sealing method of the present invention, illustrating a step of allowing a sealing member and an optical semiconductor element to face each other.

"FIG. 5 is a diagram for describing the sealing method shown in FIG. 4, illustrating a step of sealing in an optical semiconductor element."

For additional information on this patent application, see: OOYABU, Yasunari; ITO, Hisataka; SHINBORI, Yuki; SATO, Satoshi. Sealing Member, Sealing Method, and Method for Producing Optical Semiconductor Device. Filed March 14, 2014 and posted July 24, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=2083&p=42&f=G&l=50&d=PG01&S1=20140717.PD.&OS=PD/20140717&RS=PD/20140717

Keywords for this news article include: Electronics, Semiconductor, Nitto Denko Corporation.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Electronics Newsweekly


Story Tools






HispanicBusiness.com Facebook Linkedin Twitter RSS Feed Email Alerts & Newsletters