The patent's assignee is
News editors obtained the following quote from the background information supplied by the inventors: "The field of the invention is data processing, or, more specifically, methods, systems, and products for monitoring the temperature of a high powered computing component.
"The development of the EDVAC computer system of 1948 is often cited as the beginning of the computer era. Since that time, computer systems have evolved into extremely complicated devices. Today's computers are much more sophisticated than early systems such as the EDVAC. Computer systems typically include a combination of hardware and software components, application programs, operating systems, processors, buses, memory, input/output devices, and so on. As advances in semiconductor processing and computer architecture push the performance of the computer higher and higher, more sophisticated computer software has evolved to take advantage of the higher performance of the hardware, resulting in computer systems today that are much more powerful than just a few years ago.
"This increase in computing power often results in increased heat which must be administered. This heat is increasingly administered with liquid cooling of high powered computing ('HPC') components. With the increased usage of liquid cooling in HPC components, thermal interfaces on high power devices such as application specific integrated circuits, processors, graphics components and other HPC components are critical to long term reliability. These thermal interfaces are more easily monitored in a water cooled environment where a heatsink (often called a coldplate in these systems) is at a constant or very slowly changing temperature."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "Methods, systems, and products are provided for monitoring the temperature of a high powered computing component. The high powered computing component has a thermal sensor and the high powered computing component in thermal communication with a liquid cooled heatsink. Embodiments include determining, by a thermal monitoring module, a temperature of the thermal sensor; determining, by the thermal monitoring module, a temperature of the heatsink; determining, by the thermal monitoring module, a power delivered to the high powered computing component; and calculating, by the thermal monitoring module, a thermal value in dependence upon the temperature of the thermal sensor, the temperature of the heatsink, and the power delivered to the high powered computing component.
"The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular descriptions of exemplary embodiments of the invention as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts of exemplary embodiments of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
"FIG. 1 sets forth a block diagram of automated computing machinery comprising an exemplary computer useful in monitoring the temperature of a high powered computing component according to embodiments of the present invention.
"FIG. 2 sets forth a flow chart illustrating an exemplary method for monitoring the temperature of a high powered computing component according to embodiments of the present invention."
For additional information on this patent application, see: DARRINGTON,
Keywords for this news article include: Software,
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