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Patent Issued for Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die

August 6, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- STATS ChipPAC, Ltd. (Singapore, SG) has been issued patent number 8785251, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventors are Park, SooMoon (Kyonggi-do, KR); Jang, ByoungWook (Kyonggi-do, KR); Moon, DongSoo (Kyonggi-do, KR).

This patent was filed on September 9, 2013 and was published online on July 22, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "Semiconductor devices are commonly found in modern electronic products. Semiconductor devices vary in the number and density of electrical components. Discrete semiconductor devices generally contain one type of electrical component, e.g., light emitting diode (LED), small signal transistor, resistor, capacitor, inductor, and power metal oxide semiconductor field effect transistor (MOSFET). Integrated semiconductor devices typically contain hundreds to millions of electrical components. Examples of integrated semiconductor devices include microcontrollers, microprocessors, charged-coupled devices (CCDs), solar cells, and digital micro-mirror devices (DMDs).

"Semiconductor devices perform a wide range of functions such as signal processing, high-speed calculations, transmitting and receiving electromagnetic signals, controlling electronic devices, transforming sunlight to electricity, and creating visual projections for television displays. Semiconductor devices are found in the fields of entertainment, communications, power conversion, networks, computers, and consumer products. Semiconductor devices are also found in military applications, aviation, automotive, industrial controllers, and office equipment.

"Semiconductor devices exploit the electrical properties of semiconductor materials. The atomic structure of semiconductor material allows its electrical conductivity to be manipulated by the application of an electric field or base current or through the process of doping. Doping introduces impurities into the semiconductor material to manipulate and control the conductivity of the semiconductor device.

"A semiconductor device contains active and passive electrical structures. Active structures, including bipolar and field effect transistors, control the flow of electrical current. By varying levels of doping and application of an electric field or base current, the transistor either promotes or restricts the flow of electrical current. Passive structures, including resistors, capacitors, and inductors, create a relationship between voltage and current necessary to perform a variety of electrical functions. The passive and active structures are electrically connected to form circuits, which enable the semiconductor device to perform high-speed calculations and other useful functions.

"Semiconductor devices are generally manufactured using two complex manufacturing processes, i.e., front-end manufacturing, and back-end manufacturing, each involving potentially hundreds of steps. Front-end manufacturing involves the formation of a plurality of die on the surface of a semiconductor wafer. Each die is typically identical and contains circuits formed by electrically connecting active and passive components. Back-end manufacturing involves singulating individual die from the finished wafer and packaging the die to provide structural support and environmental isolation.

"One goal of semiconductor manufacturing is to produce smaller semiconductor devices. Smaller devices typically consume less power, have higher performance, and can be produced more efficiently. In addition, smaller semiconductor devices have a smaller footprint, which is desirable for smaller end products. A smaller die size may be achieved by improvements in the front-end process resulting in die with smaller, higher density active and passive components. Back-end processes may result in semiconductor device packages with a smaller footprint by improvements in electrical interconnection and packaging materials.

"A semiconductor die is commonly mounted over a substrate with an encapsulant deposited between the semiconductor die and substrate, as shown in FIG. 1a. A dispensing needle 10 pushes encapsulant 12 into area 14 between semiconductor die 16 and substrate 18. Dispensing needle 10 moves back and forth between reference point 20 and reference point 22 across a width of semiconductor die 16 while injecting encapsulant 12 into area 14, as shown in FIG. 1b. Dispensing needle 10 stops at each reference point before returning to the opposite reference point. In some embodiments, the flow of encapsulant 12 is momentarily shut off at each change of direction of dispensing needle 10. Encapsulant 12 is known to build up unevenly in area 14 due to the start and stop and intermediate motion of dispensing needle 10. For example, encapsulant 12a is deposited into area 14 during a pass of dispensing needle from reference point 20 to reference point 22. Encapsulant 12b is deposited into area 14 during the return pass of dispensing needle from reference point 22 to reference point 20. The transitional dispensing motion takes considerable time to complete and can cause encapsulant bleed-out and form voids in encapsulant 12 due to discontinuous and uneven flow."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventors' summary information for this patent: "A need exists to evenly deposit mold underfill between a semiconductor die and substrate without forming voids or inducing underfill bleed-out from the semiconductor die. Accordingly, in one embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a substrate, disposing a semiconductor die over the substrate, disposing a dispensing needle in fluid communication with the semiconductor die, and dispensing an underfill material from the dispensing needle between the semiconductor die and substrate. The dispensing needle includes a width substantially equal to a width of the semiconductor die.

"In another embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a substrate, disposing a semiconductor die over the substrate, disposing a stationary dispensing needle in fluid communication across a width of the semiconductor die, and dispensing an underfill material from the stationary dispensing needle between the semiconductor die and substrate.

"In another embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a substrate, disposing a semiconductor die over the substrate, and disposing a dispensing needle in fluid communication across a width of the semiconductor die and including an outlet disposed adjacent to a gap between the semiconductor die and substrate.

"In another embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a substrate, disposing a semiconductor die over the substrate, and disposing a dispensing needle in fluid communication across a width of the semiconductor die."

For the URL and additional information on this patent, see: Park, SooMoon; Jang, ByoungWook; Moon, DongSoo. Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die. U.S. Patent Number 8785251, filed September 9, 2013, and published online on July 22, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8785251.PN.&OS=PN/8785251RS=PN/8785251

Keywords for this news article include: Electronics, Semiconductor, STATS ChipPAC Ltd..

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Source: Electronics Newsweekly


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