News Column

Patent Issued for Printed Circuit Board and Method for Manufacturing the Same

August 6, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventors Oh, Hueng Jae (Gyunggi-do, KR); Jung, Boo Yang (Gyunggi-do, KR); Lee, Dae Young (Gyunggi-do, KR); Choi, Jin Won (Gyunggi-do, KR), filed on February 22, 2012, was published online on July 22, 2014.

The assignee for this patent, patent number 8785789, is Samsung Electro-Mechanics Co., Ltd. (Gyunggi-Do, KR).

Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to a printed circuit board and a method for manufacturing the same.

"With the development of the electronics industry, electronic components are increasingly required to have high performance, be multifunctional and have a smaller size. According to the trend, requirements for substrates used for surface-mounted components such as a system in package (SIP), a 3D package, and the like, to become highly integrated and thinner and have a fine circuit pattern have emerged.

"In a surface mount technology for mounting external elements such as a semiconductor chip, and the like, a wire boning scheme and a flip chip bonding scheme are used to electrically connect the semiconductor chip and a printed circuit board (PCB). However, in the case of the wire bonding scheme, since the semiconductor chip is connected to the PCB by using a wire, the size of a module is increased, an additional process is required, and there is a limitation in implementing a fine pitch, so the flip chip bonding scheme is commonly used, instead.

"According to the flip chip bonding scheme, bumps made of gold, solder, or any other metals and having a size ranging from tens to hundreds of um are formed on a semiconductor chip or a PCB on which a semiconductor chip is to be mounted, and a semiconductor chip is mounted on the PCB (See Korean Patent Laid Open Publication No. 2001-0107767).

"However, as PCBs are becoming fine, an opening of a pad on which bumps are formed is reduced, causing problems such as a degradation of bonding strength between PCBs and bumps, a reduction in mounting stability, defective underfill, and the like."

In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventors' summary information for this patent: "The present invention has been made in an effort to provide a printed circuit board (PCB) having enhanced mounting stability of external elements, and a method for manufacturing the same.

"The present invention has also been made in an effort to provide a PCB including a metal post having enhanced bonding strength, and a method for manufacturing the same.

"The present invention has also been made in an effort to provide a PCB in which a formation of voids is prevented during an underfill process, and a method for manufacturing the same.

"According to a preferred embodiment of the present invention, there is provided a printed circuit board (PCB) including: a base substrate; a circuit layer formed on the base substrate and including a connection pad; a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad; a metal post formed on upper portions of the exposed connection pad and the solder resist layer and having a plurality of diameters; and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post.

"The metal post may include: a first post portion formed within the opening; a second post portion formed on upper portions of the first post portion and the solder resist layer; and a third post portion formed on an upper portion of the second post portion.

"In the metal post, the diameter of the third post portion may be greater than that of the second portion.

"In the metal post, the diameter of the third post portion may be smaller than that of the second portion.

"The seed layer may be formed through electroless plating.

"The metal post may be formed through electroplating.

"According to another preferred embodiment of the present invention, there is provided a method for manufacturing a printed circuit board (PCB), including: preparing a base substrate on which a circuit layer including a connection pad is formed; forming a solder resist layer having a first opening exposing the connection pad on an upper portion of the base substrate; forming a first plated resist layer which has a second opening exposing the first opening and has a diameter greater than that of the first opening on an upper portion of the solder resist layer; forming a seed layer on an upper portion of the first plated resist layer, on an inner wall of the first opening, and on an inner wall of the second opening; forming a second plated resist layer which has a third opening exposing the first opening on an upper portion of the seed layer; plating the interior of the first through third openings to form a metal post; eliminating the second plated resist layer; eliminating the seed layer exposed through the elimination of the second plated resist layer; and eliminating the first plated resist layer exposed through the elimination of the seed layer.

"In the forming of the second plated resist layer, the third opening may be formed to have a diameter greater than that of the second opening.

"In the forming of the second plated resist layer, the third opening may be formed to have a diameter smaller than that of the second opening.

"In the forming of the seed layer, the seed layer may be formed through electroless plating.

"In the forming of the metal post, the metal post may be formed through electroplating.

"The method may further include: planarizing the metal post after eliminating the second plated resist layer.

"In the planarizing of the metal post, the metal post may be planarized through a polishing process."

For more information, see this patent: Oh, Hueng Jae; Jung, Boo Yang; Lee, Dae Young; Choi, Jin Won. Printed Circuit Board and Method for Manufacturing the Same. U.S. Patent Number 8785789, filed February 22, 2012, and published online on July 22, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8785789.PN.&OS=PN/8785789RS=PN/8785789

Keywords for this news article include: Electronics, Circuit Board, Semiconductor, Samsung Electro-Mechanics Co. Ltd..

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Source: Electronics Newsweekly


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