Reports Outline Coatings Technology Study Findings from
The news reporters obtained a quote from the research, "The growth mechanism of copper layers was discussed. Results show that numerous folds, uneven steps, and other defects appear on the microscopic surface of activated plastic. After direct electroless plating, the plating layer on the plastic surface exhibits a closely bound granular distribution. Compared with the conventional pretreatment process, the plating layer possesses a similar morphology. The growth mechanisms are analyzed as follows: the reactant (Cu2+) in the electroless plating solution disperses and is adsorbed by the plastic surface in the process of Cu plating. The Cu particles that settled form the nucleus and grow. The growth process involves repeated gathering of nano-level Cu grains to form physically agglomerated Cu granules."
According to the news reporters, the research concluded: "The Cu grains finally merge to allow closely bound and evenly distributed copper plating."
For more information on this research see: Electroless copper plating on PC engineering plastic with a novel palladium-free surface activation process. Surface & Coatings Technology, 2014;251():69-73. Surface & Coatings Technology can be contacted at: Elsevier Science Sa, PO Box 564, 1001 Lausanne,
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