News Column

Reports Outline Coatings Technology Study Findings from L.M. Luo and Colleagues (Electroless copper plating on PC engineering plastic with a novel...

July 30, 2014



Reports Outline Coatings Technology Study Findings from L.M. Luo and Colleagues (Electroless copper plating on PC engineering plastic with a novel palladium-free surface activation process)

By a News Reporter-Staff News Editor at Journal of Engineering -- Data detailed on Coatings Technology have been presented. According to news reporting originating in Hefei, People's Republic of China, by VerticalNews journalists, research stated, "This paper proposes a new available palladium-free surface activation process on polycarbonate (PC) engineering plastic before electroless plating. Surface morphologies of the original plastic, activated plastic, surface and cross-sections after electroless plating were analyzed by field emission scanning electron microscopy (FE-SEM), energy dispersion spectrometry (EDS) and X-ray diffraction (XRD)."

The news reporters obtained a quote from the research, "The growth mechanism of copper layers was discussed. Results show that numerous folds, uneven steps, and other defects appear on the microscopic surface of activated plastic. After direct electroless plating, the plating layer on the plastic surface exhibits a closely bound granular distribution. Compared with the conventional pretreatment process, the plating layer possesses a similar morphology. The growth mechanisms are analyzed as follows: the reactant (Cu2+) in the electroless plating solution disperses and is adsorbed by the plastic surface in the process of Cu plating. The Cu particles that settled form the nucleus and grow. The growth process involves repeated gathering of nano-level Cu grains to form physically agglomerated Cu granules."

According to the news reporters, the research concluded: "The Cu grains finally merge to allow closely bound and evenly distributed copper plating."

For more information on this research see: Electroless copper plating on PC engineering plastic with a novel palladium-free surface activation process. Surface & Coatings Technology, 2014;251():69-73. Surface & Coatings Technology can be contacted at: Elsevier Science Sa, PO Box 564, 1001 Lausanne, Switzerland. (Elsevier - www.elsevier.com; Surface & Coatings Technology - www.elsevier.com/wps/product/cws_home/504101)

Our news correspondents report that additional information may be obtained by contacting L.M. Luo, Labs Nonferrous Met Mat & Proc Engn Anhui Prov, Hefei 230009, People's Republic of China. Additional authors for this research include Z.L. Lu, X.M. Huang, X.Y. Tan, X.Y. Ding, J.G. Cheng, L. Zhu and Y.C. Wu.

Keywords for this news article include: Hefei, People's Republic of China, Asia, Coatings Technology, Engineering, Palladium, Transition Elements

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Journal of Engineering


Story Tools






HispanicBusiness.com Facebook Linkedin Twitter RSS Feed Email Alerts & Newsletters