News Column

Patent Issued for Card Switch

July 30, 2014



By a News Reporter-Staff News Editor at Journal of Engineering -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventor Ledevehat, Yannick (Quebec, CA), filed on July 13, 2012, was published online on July 15, 2014.

The patent's assignee for patent number 8777115 is Syscard Innovations inc. (Quebec, QC, unknown).

News editors obtained the following quote from the background information supplied by the inventors: "When manufacturing an electronic smart card, i.e. a card with electronics such as a smart card for instance and typically provided in the standard width and length dimensions of 85.6.times.53.98 mm, fillers, such as liquid adhesives, may be used to give structural integrity to the card and secure electronic components within the housing of the card. The card thus forms a particular confined and hermetic environment and although it was highly sought to incorporate switches to such cards, the confined and hermetic environment made it very difficult to do so. Switches incorporated in electronic cards thus began to loose their functionality in card thicknesses approaching 0.8 mm at least partially because the thickness of filler covering the switches increased the pressure threshold required to activate the switch and/or reduced the sensation of feedback to the user once the switch was successfully activated.

"Accordingly, there is a need for an improved switch for an electronic card, particularly in the case of electronic cards having a thickness greater than about 0.8 mm."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventor's summary information for this patent: "In one aspect, there is provided an electronic card comprising a sealed housing having a first surface and a second surface opposite the first surface; a switch member mounted within the housing adjacent the first surface and movable relative to the housing along an axis perpendicular to the first surface between a rest position and an actuated position; and an actuation member mounted within the housing and movable relative thereto along the axis, the actuation member having an actuation surface adjacent the second surface of the housing and a contact surface opposite the actuation surface and adjacent the switch member, wherein, upon application of a pressure on the second surface, the pressure is applied on the actuation surface, thereby displacing the actuation member along the axis with the contact surface exerting the pressure on the switch member and moving the switch member from the rest position to the actuated position.

"In another aspect, there is provided a switch assembly for an electronic card comprising a sealed housing having a first surface and a second surface opposite the first surface, the switch assembly comprising a switch member mounted within the housing adjacent the first surface and movable relative to the housing along an axis perpendicular to the first surface between a rest position and an actuated position; and an actuation member mounted within the housing and movable relative thereto along the axis, the actuation member having an actuation surface adjacent the second surface of the housing and a contact surface opposite the actuation surface and adjacent the switch member, wherein, upon application of a pressure on the second surface, the pressure is applied on the actuation surface, thereby displacing the actuation member along the axis with the contact surface exerting the pressure on the switch member and moving the switch member from the rest position to the actuated position."

For additional information on this patent, see: Ledevehat, Yannick. Card Switch. U.S. Patent Number 8777115, filed July 13, 2012, and published online on July 15, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8777115.PN.&OS=PN/8777115RS=PN/8777115

Keywords for this news article include: Syscard Innovations inc.

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Source: Journal of Engineering


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