News Column

Advanced Semiconductor Engineering, Inc. Prices Guaranteed Bond Offering

July 30, 2014



By a News Reporter-Staff News Editor at Engineering Business Journal -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE", or the "Company") announced that it has priced an offering of US$300 million aggregate principal amount of guaranteed bonds due 2017 offered by Anstock II Limited, its wholly owned subsidiary (the "Bonds"). The Bonds are unconditionally and irrevocably guaranteed by ASE. The proceeds will be used to fund certain eligible projects to promote the Company's transition to low-carbon and climate resilient growth. Examples of eligible projects may include, among other projects, green buildings, waste water recycling projects, waste water management and projects promoting energy efficiency in manufacturing processes. The Bonds were offered outside the United States pursuant to Regulation S under the Securities Act of 1933, as amended (the "Act").

The Bonds have not been and will not be registered under the Act and these securities may not be offered or sold in the United States absent registration or an applicable exemption from registration requirements.

Keywords for this news article include: Advanced Semiconductor Engineering, Advanced Semiconductor Engineering Inc., Electronics, Engineering, Semiconductor.

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Source: Engineering Business Journal


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